- 您现在的位置：买卖IC网 > PDF目录4092 > MPC8270VVUPEA (Freescale Semiconductor)IC MPU POWERQUICC II 480-TBGA PDF资料下载
参数资料
| 型号： | MPC8270VVUPEA |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 73/83页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC II 480-TBGA |
| 标准包装： | 21 |
| 系列： | MPC82xx |
| 处理器类型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 450MHz |
| 电压： | 1.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 480-LBGA |
| 供应商设备封装： | 408-TBGA（37.5x37.5） |
| 包装： | 托盘 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页当前第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页
MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
75
Package Description
9
Package Description
This figure shows the side profile of the TBGA package to indicate the direction of the top surface view.
Figure 15. Side View of the TBGA Package
This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.
Figure 16. Side View of the PBGA Package Remove
3 Must be pulled down or left floating.
4 If PCI is not desired, must be pulled up or left floating.
5 Sphere is not connected to die.
6 GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground
signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in Section 4.6, “Layout
Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to
GND with the noise filtering capacitors.
7 XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no need for
external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in which the
MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Soldermask
Copper Traces
Die
Copper Heat Spreader
(Oxidized for Insulation)
1.27 mm Pitch
Glob-Top Dam
Wire Bonds
Etched
Pressure Sensitive
Die
Glob-Top Filled Area
Polymide Tape
Cavity
Adhesive
Attach
View
Die
Transfer molding compound
1 mm pitch
Wire bonds
attach
DIE
Ball bond
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
Plated substrate via
相关PDF资料 |
PDF描述 |
|---|---|
| HSC20DTEF | CONN EDGECARD 40POS .100 EYELET |
| MPC860SRZQ80D4 | IC MPU POWERQUICC 80MHZ 357PBGA |
| HMC60DRAN | CONN EDGECARD 120PS R/A .100 SLD |
| HMC60DRAH | CONN EDGECARD 120PS R/A .100 SLD |
| FMC40DRXN | CONN EDGECARD 80POS DIP .100 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8270VVUPEA | 制造商:Freescale Semiconductor 功能描述:PQ II HIP 7 REV A NO-PB |
| MPC8270ZQ | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:PowerQUICC II Family Hardware Specifications |
| MPC8270ZQB | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8270ZQE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8270ZQI | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
发布紧急采购，3分钟左右您将得到回复。