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参数资料
| 型号： | MPC8270ZUSLDX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 375 MHz, RISC PROCESSOR, PBGA480 |
| 封装： | 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 |
| 文件页数： | 3/80页 |
| 文件大小： | 536K |
| 代理商： | MPC8270ZUSLDX |
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MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
11
Thermal Characteristics
4
Thermal Characteristics
Table 6 describes thermal characteristics for both the packages. See Table 2 for information about a given device’s
package. For the discussions sections 4.1 and 4.5, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of
the I/O drivers.
4.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity TJ – TA) are possible.
3
The leakage current is measured for nominal VDDH,VCCSYN, and VDD.
4
VIL for IIC interface does not match IIC standard, but does meet IIC standard for VOL and should not cause any compatibility
issue.
5
MPC8280, MPC8275VR, MPC8275ZQ only.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
480 TBGA
516 PBGA
Junction to ambient—
single-layer board 1
1
Assumes no thermal vias.
RθJA
16
27
°C/W
Natural convection
11
21
1 m/s
Junction to ambient—
four-layer board
RθJA
12
19
°C/W
Natural convection
916
1 m/s
Junction to board 2
2
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RθJB
611
°C/W
—
Junction to case 3
3
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
RθJC
28
°C/W
—
Junction-to-package top 4
4
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
ΨJT
22
°C/W
—
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