- 您现在的位置：买卖IC网 > PDF目录80398 > MPC8272VRPIEX (FREESCALE SEMICONDUCTOR INC) 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516 PDF资料下载
参数资料
| 型号： | MPC8272VRPIEX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516 |
| 封装： | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-516 |
| 文件页数： | 5/60页 |
| 文件大小： | 746K |
| 代理商： | MPC8272VRPIEX |
第1页第2页第3页第4页当前第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
13
Thermal Characteristics
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (C/W)
RθJC = junction-to-case thermal resistance (C/W)
RθCA = case-to-ambient thermal resistance (C/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to
affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
4.3
Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a
two-resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The
junction-to-case thermal resistance covers the situation where a heat sink is used or where a substantial
amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance
describes the thermal performance when most of the heat is conducted to the printed circuit board. It has
been observed that the thermal performance of most plastic packages, especially PBGA packages, is
strongly dependent on the board temperature.
If the board temperature is known, an estimate of the junction temperature in the environment can be made
using the following equation:
TJ = TB + (RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (C/W)
TB = board temperature (C)
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored,
acceptable predictions of junction temperature can be made. For this method to work, the board and board
mounting must be similar to the test board used to determine the junction-to-board thermal resistance,
namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground
plane.
4.4
Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple
two-resistor model can be used with the thermal simulation of the application, or a more accurate and
complex model of the package can be used in the thermal simulation.
相关PDF资料 |
PDF描述 |
|---|---|
| MC9S12HA64VLLR | 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP100 |
| MC908QB8MDTE | 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO16 |
| MC56F8122VFAE | 0-BIT, 80 MHz, OTHER DSP, PQFP48 |
| MC908GR32AMFJR2 | 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PQFP32 |
| MC908GR60AMFAR2 | 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PQFP48 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8272VRT | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8272VRTIEA | 功能描述:微处理器 - MPU 400 MHz 760 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8272VRTMFA | 功能描述:微处理器 - MPU PQ27E A W/ TALITOS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8272ZQ | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8272ZQB | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
发布紧急采购，3分钟左右您将得到回复。