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参数资料
| 型号： | MPC8272VRPIEX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516 |
| 封装： | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-516 |
| 文件页数： | 7/60页 |
| 文件大小： | 746K |
| 代理商： | MPC8272VRPIEX |
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MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
15
Power Dissipation
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
5
Power Dissipation
Table 7 provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required to ensure the junction temperature does not exceed the maximum
specified value. Also note that the I/O power should be included when determining whether to use a heat
sink. For a complete list of possible clock configurations, refer to Section 7, “Clock Configuration
Table 7. Estimated Power Dissipation for Various Configurations 1
1
Test temperature = 105
° C
Bus
(MHz)
CPM
Multiplication
Factor
CPM
(MHz)
CPU
Multiplication
Factor
CPU
(MHz)
PINT(W)
2, 3
2
PINT = IDD x VDD Watts
3
Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
66.7 MHz = 0.35 W (nominal), 0.4 W (maximum)
83.3 MHz = 0.4 W (nominal), 0.5 W (maximum)
100 MHz = 0.5 W (nominal), 0.6 W (maximum)
133 MHz = 0.7 W (nominal), 0.8 W (maximum)
Vddl 1.5 Volts
Nominal
Maximum
66.67
3
200
4
266
1
1.2
100
2
200
3
300
1.1
1.3
100
2
200
4
400
1.3
1.5
133
2
267
3
400
1.5
1.8
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相关代理商/技术参数 |
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