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| 型号： | MPC8308VMAGDA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | RISC MICROCONTROLLER, PBGA473 |
| 封装： | 19 X 19 MM, 1.39 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MABGA-473 |
| 文件页数： | 83/90页 |
| 文件大小： | 1123K |
| 代理商： | MPC8308VMAGDA |
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MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2
84
Freescale Semiconductor
System Design Information
These decoupling capacitors should receive their power from separate VDD, NVDD, GVDD, LVDD, and
VSS power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed
directly under the device using a standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, NVDD, GVDD, LVDD planes, to enable quick recharging of the smaller chip capacitors.
These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick
response time necessary. They should also be connected to the power and ground planes through two vias
to minimize inductance. Suggested bulk capacitors—100 to 330 F (AVX TPS tantalum or Sanyo
OSCON). However, customers should work directly with their power regulator vendor for best values and
types of bulk capacitors.
23.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to NVDD, GVDD, LVDD as required. Unused active high
inputs should be connected to VSS. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, NVDD, AVDD1, AVDD2, GVDD, LVDD
and VSS pins of the device.
23.5
Output Buffer DC Impedance
The device drivers are characterized over process, voltage, and temperature. For all buses, the driver is a
push-pull single-ended driver type (open drain for I2C, MDIO and HRESET)
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to NVDD
or VSS. Then, the value of each resistor is varied until the pad voltage is NVDD/2 (Figure 55). The output
impedance is the average of two components, the resistances of the pull-up and pull-down devices. When
data is held high, SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals
NVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
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| MPC8308ZQADD | 功能描述:微处理器 - MPU E300 MP Pb 266 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8308ZQADDA | 功能描述:微处理器 - MPU E300 MP Pb 266 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8308ZQAFD | 功能描述:微处理器 - MPU E300 MP Pb 333 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8308ZQAFDA | 功能描述:微处理器 - MPU E300 MP Pb 333 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8308ZQAGD | 功能描述:微处理器 - MPU E300 MP Pb 400 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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