参数资料
型号: MPC8313E-RDBC
厂商: Freescale Semiconductor
文件页数: 18/99页
文件大小: 0K
描述: BOARD CPU 8313E VER 2.2
标准包装: 1
系列: PowerQUICC II™ PRO
类型: MPU
适用于相关产品: MPC8313E
所含物品:
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
25
This figure shows the MII receive AC timing diagram.
Figure 10. MII Receive AC Timing Diagram RMII AC Timing Specifications
8.2.1.3
RMII Transmit AC Timing Specifications
This table provides the RMII transmit AC timing specifications.
This figure shows the RMII transmit AC timing diagram.
Figure 11. RMII Transmit AC Timing Diagram
Table 28. RMII Transmit AC Timing Specifications
At recommended operating conditions with NVDD of 3.3 V ± 0.3 V.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
REF_CLK clock
tRMX
—20—
ns
REF_CLK duty cycle
tRMXH/tRMX
35
65
%
REF_CLK to RMII data TXD[1:0], TX_EN delay
tRMTKHDX
2
10
ns
REF_CLK data clock rise VIL(min) to VIH(max)
tRMXR
1.0
4.0
ns
REF_CLK data clock fall VIH(max) to VIL(min)
tRMXF
1.0
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMTKHDX symbolizes RMII
transmit timing (RMT) for the time tRMX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that,
in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular
functional. For example, the subscript of tRMX represents the RMII(RM) reference (X) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
RX_CLK
RXD[3:0]
tMRDXKH
tMRX
tMRXH
tMRXR
tMRXF
RX_DV
RX_ER
tMRDVKH
Valid Data
REF_CLK
TXD[1:0]
tRMTKHDX
tRMX
tRMXH
tRMXR
tRMXF
TX_EN
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