参数资料
型号: MPC8321EVRADDCA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516
封装: 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, PBGA-516
文件页数: 44/82页
文件大小: 1059K
代理商: MPC8321EVRADDCA
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
49
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the
information on the PBGA.
21.1
Package Parameters for the MPC8323E PBGA
The package parameters are as provided in the following list. The package type is 27 mm
× 27 mm, 516
PBGA.
Package outline
27 mm
× 27 mm
Interconnects
516
Pitch
1.00 mm
Module height (typical)
2.25 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.6 mm
21.2
Mechanical Dimensions of the MPC8323E PBGA
Figure 42 shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
516-PBGA package.
相关PDF资料
PDF描述
MPC8321CVRADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516
MPC8321ECZQADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516
MPC8321VRADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516
MPC8321CZQADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516
MPC8321EZQAFDCA 32-BIT, 333 MHz, RISC PROCESSOR, PBGA516
相关代理商/技术参数
参数描述
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