参数资料
型号: MPC8347ECZUADD
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA672
封装: 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
文件页数: 56/102页
文件大小: 1094K
代理商: MPC8347ECZUADD
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Freescale Semiconductor
57
Package and Pin Listings
18.3
Package Parameters for the MPC8347E PBGA
The package parameters are as provided in the following list. The package type is 29 mm
× 29 mm,
620 plastic ball grid array (PBGA).
Package outline
29 mm
× 29 mm
Interconnects
620
Pitch
1.00 mm
Module height (maximum)
2.46 mm
Module height (typical)
2.23 mm
Module height (minimum)
2.00 mm
Solder balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.60 mm
相关PDF资料
PDF描述
MPC8347ECZUALD 32-BIT, 667 MHz, RISC PROCESSOR, PBGA672
MPC8347ZUAJF 32-BIT, 533 MHz, RISC PROCESSOR, PBGA672
MPC8347VRAJD 32-BIT, 533 MHz, RISC PROCESSOR, PBGA620
MPC8347ECVRAGD 32-BIT, 400 MHz, RISC PROCESSOR, PBGA620
MPC8347VVADF 32-BIT, 266 MHz, RISC PROCESSOR, PBGA672
相关代理商/技术参数
参数描述
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