参数资料
型号: MPC8347ECZUADD
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA672
封装: 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
文件页数: 93/102页
文件大小: 1094K
代理商: MPC8347ECZUADD
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
90
Freescale Semiconductor
Thermal
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.
TJ = TC + (RθJC × PD)
where:
TJ = junction temperature (°C)
TC = case temperature of the package (°C)
RθJC = junction-to-case thermal resistance (°C/W)
PD = power dissipation (W)
相关PDF资料
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MPC8347ECZUALD 32-BIT, 667 MHz, RISC PROCESSOR, PBGA672
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相关代理商/技术参数
参数描述
MPC8347ECZUADDB 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECZUADFB 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECZUAGDB 功能描述:微处理器 - MPU 8349 TBGA W/ ENCRYP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8347ECZUAGFB 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECZUAJDB 功能描述:微处理器 - MPU 8349 TBGA W/ ENCRYP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324