参数资料
型号: MPC8349ECVVAGDB
厂商: Freescale Semiconductor
文件页数: 62/87页
文件大小: 0K
描述: IC MPU POWERQUICC II 672-TBGA
标准包装: 24
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 672-LBGA
供应商设备封装: 672-TBGA(35x35)
包装: 托盘
配用: MPC8349E-MITX-GP-ND - KIT REFERENCE PLATFORM MPC8349E
MPC8349E-MITXE-ND - BOARD REFERENCE FOR MPC8349
MPC8349EA-MDS-PB-ND - KIT MODULAR DEV SYSTEM MPC8349E
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
65
Package and Pin Listings
MVREF2
AD2
I
DDR
reference
voltage
Notes:
1. This pin is an open-drain signal. A weak pull-up resistor (1 k
Ω) should be placed on this pin to OV
DD.
2. This pin is an open-drain signal. A weak pull-up resistor (2–10 k
Ω) should be placed on this pin to OV
DD.
3. During reset, this output is actively driven rather than three-stated.
4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull-up if the chip is in PCI host mode. Follow the PCI specifications.
6. This pin must always be tied to GND.
7. This pin must always be left not connected.
8. Thermal sensitive resistor.
9. It is recommended that MDIC0 be tied to GND using an 18.2
Ω resistor and MDIC1 be tied to DDR power using an 18.2 Ω
resistor.
10.TSEC1_TXD[3] is required an external pull-up resistor. For proper functionality of the device, this pin must be pulled up or
actively driven high during a hard reset. No external pull-down resistors are allowed to be attached to this net.
11. A weak pull-up resistor (2–10 k
Ω) should be placed on this pin to LV
DD1.
12. For systems that boot from local bus (GPCM)-controlled NOR flash, a pullup on LGPL4 is required.
Table 55. MPC8349EA (TBGA) Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
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