参数资料
型号: MPC8349ECZUAGD
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, PBGA672
封装: 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
文件页数: 106/108页
文件大小: 1275K
代理商: MPC8349ECZUAGD
MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 7
Freescale Semiconductor
97
Thermal
20.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction to case thermal resistance.
TJ = TC + (RθJC × PD)
where:
TJ = junction temperature (°C)
TC = case temperature of the package (°C)
RθJC = junction to case thermal resistance (°C/W)
PD = power dissipation (W)
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