参数资料
型号: MPC8358EVRAGDDA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, PBGA668
封装: 29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668
文件页数: 14/95页
文件大小: 1225K
代理商: MPC8358EVRAGDDA
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
Freescale Semiconductor
21
DDR and DDR2 SDRAM
Figure 5 shows the input timing diagram for the DDR controller.
Figure 5. DDR Input Timing Diagram
6.2.2
DDR and DDR2 SDRAM Output AC Timing Specifications
Table 20 and Table 21 provide the output AC timing specifications and measurement conditions for the
DDR and DDR2 SDRAM interface.
Table 19. DDR and DDR2 SDRAM Input AC Timing Specifications Mode
At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%.
Parameter
Symbol
Min
Max
Unit
Notes
MDQS—MDQ/MECC input skew per byte
266 MHz
200 MHz
tDISKEW
–1125
–1250
1125
1250
ps
1, 2
Notes:
1. AC timing values are based on the DDR data rate, which is twice the DDR memory bus frequency.
2. Maximum possible skew between a data strobe (MDQS[n]) and any corresponding bit of data (MDQ[8n + {0...7}] if 0
≤ n ≤ 7)
or ECC (MECC[{0...7}] if n = 8).
Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications for Source
Synchronous Mode
At recommended operating conditions with GVDD of (1.8 V or 2.5 V) ± 5%.
Parameter8
Symbol1
Min
Max
Unit
Notes
MCK[n] cycle time, (MCK[n]/MCK[n] crossing)
tMCK
610
ns
2
Skew between any MCK to ADDR/CMD
266 MHz
200 MHz
tAOSKEW
–1.1
–1.2
0.3
0.4
ns
3
MCK[n]
tMCK
MDQ[x]
MDQS[n]
tDISKEW
D1
D0
tDISKEW
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相关代理商/技术参数
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