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| 型号： | MPC8360ECVVAJDGA |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 23/102页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC II PRO 740TBGA |
| 标准包装： | 21 |
| 系列： | MPC83xx |
| 处理器类型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 533MHz |
| 电压： | 1.2V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 740-LBGA |
| 供应商设备封装： | 740-TBGA（37.5x37.5） |
| 包装： | 托盘 |
| 配用： | MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC |
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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
27
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
8.2.1.1
GMII Transmit AC Timing Specifications
This table provides the GMII transmit AC timing specifications.
This figure shows the GMII transmit AC timing diagram.
Figure 10. GMII Transmit AC Timing Diagram
Table 27. GMII Transmit AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Notes
GTX_CLK clock period
tGTX
—8.0
—
ns
—
GTX_CLK duty cycle
tGTXH/tGTX
40
—
60
%
—
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
tGTKHDX
tGTKHDV
0.5
—
——
5.0
ns
GTX_CLK clock rise time, (20% to 80%)
tGTXR
——
1.0
ns
—
GTX_CLK clock fall time, (80% to 20%)
tGTXF
——
1.0
ns
—
GTX_CLK125 clock period
tG125
—8.0
—
ns
GTX_CLK125 reference clock duty cycle measured at
LVDD/2
tG125H/tG125
45
—
55
%
Notes:
1. The symbols used for timing specifications follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII
transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input
signals (D) reaching the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with
respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X)
or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock
of a particular functional. For example, the subscript of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall
times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. This symbol is used to represent the external GTX_CLK125 signal and does not follow the original symbol naming
convention.
3. In rev. 2.0 silicon, due to errata, tGTKHDX minimum and tGTKHDV maximum are not supported when the GTX_CLK is
selected. Refer to Errata QE_ENET18 in Chip Errata for the MPC8360E, Rev. 1.
GTX_CLK
TXD[7:0]
tGTKHDX
tGTX
tGTXH
tGTXR
tGTXF
TX_EN
TX_ER
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8360ECVVAJDHA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVAJFGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVAJFHA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVALDGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVALDHA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
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