参数资料
型号: MPC8360ZUALFHA
厂商: Freescale Semiconductor
文件页数: 25/102页
文件大小: 0K
描述: IC MPU POWERQUICC II PRO 740TBGA
标准包装: 21
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 667MHz
电压: 1.3V
安装类型: 表面贴装
封装/外壳: 740-LBGA
供应商设备封装: 740-TBGA(37.5x37.5)
包装: 托盘
配用: MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
29
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
8.2.2
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
8.2.2.1
MII Transmit AC Timing Specifications
This table provides the MII transmit AC timing specifications.
This figure shows the MII transmit AC timing diagram.
Figure 12. MII Transmit AC Timing Diagram
Table 29. MII Transmit AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
—400
ns
TX_CLK clock period 100 Mbps
tMTX
—40—
ns
TX_CLK duty cycle
tMTXH/tMTX
35
65
%
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
tMTKHDX
tMTKHDV
1
5—
15
ns
TX_CLK data clock rise time, (20% to 80%)
tMTXR
1.0
4.0
ns
TX_CLK data clock fall time, (80% to 20%)
tMTXF
1.0
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit
timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general,
the clock reference symbol representation is based on two to three letters representing the clock of a particular functional.
For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is
used with the appropriate letter: R (rise) or F (fall).
TX_CLK
TXD[3:0]
tMTKHDX
tMTX
tMTXH
tMTXR
tMTXF
TX_EN
TX_ER
相关PDF资料
PDF描述
MPC8360VVALFHA IC MPU POWERQUICC II PRO 740TBGA
MPC745BVT300LE MCU HIP4DP 300MHZ 255-PBGA
MPC745BPX300LE MCU HIP4DP 300MHZ 255-PBGA
XF2M-3615-1A CONN FPC 36POS 0.5MM PITCH SMD
MPC8250ACVVMHBC IC MPU POWERQUICC II 480-TBGA
相关代理商/技术参数
参数描述
MPC8377CVRAFDA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8377CVRAFFA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8377CVRAFGA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8377CVRAGD 功能描述:微处理器 - MPU PBGA W/O ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8377CVRAGDA 功能描述:微处理器 - MPU 8377 PBGA XT PbFr No ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324