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参数资料
型号： MPC8378ECVRAJF
厂商： Freescale Semiconductor
文件页数： 25/128页
文件大小： 0K
描述： MPU POWERQUICC II PRO 689-PBGA
标准包装： 27
系列： MPC83xx
处理器类型： 32-位 MPC83xx PowerQUICC II Pro
速度： 533MHz
电压： 1V
安装类型： 表面贴装
封装/外壳： 689-BBGA 裸露焊盘
供应商设备封装： 689-TEPBGA II（31x31）
包装： 托盘
MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
120
Freescale Semiconductor
Tyco Electronics
Chip Coolers
www.chipcoolers.com
Wakefield Engineering
www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
www.dowcorning.com
Shin-Etsu MicroSi, Inc.
www.microsi.com
The Bergquist Company
www.bergquistcompany.com
23.3
Heat Sink Attachment
The device requires the use of heat sinks. When heat sinks are attached, an interface material is required,
preferably thermal grease and a spring clip. The spring clip should connect to the printed circuit board,
either to the board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces
that can lift the edge of the package or peel the package from the board. Such peeling forces reduce the
solder joint lifetime of the package. The recommended maximum compressive force on the top of the
package is 10 lb force (4.5 kg force). Any adhesive attachment should attach to painted or plastic surfaces,
and its performance should be verified under the application requirements.
23.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction to case thermal resistance.
TJ = TC + (RθJC × PD)
where:
TJ = junction temperature (°C)
TC = case temperature of the package (°C)
相关PDF资料
PDF描述
395-012-520-204 CARD EDGE 12POS DL .100X.200 BLK
MPC8378ECVRAGD MPU POWERQUICC II PRO 689-PBGA
CAT93C66YI-GT3 IC EEPROM 4KB 2MHZ 8-TSSOP
395-012-520-202 CARD EDGE 12POS DL .100X.200 BLK
395-012-520-201 CARD EDGE 12POS DL .100X.200 BLK
相关代理商/技术参数
参数描述
MPC8378ECVRAJFA 功能描述:微处理器 - MPU 8378 PBGA XT PbFr W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8378ECVRAJGA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378ECVRALDA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378ECVRALFA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378ECVRALG 功能描述:微处理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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