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参数资料
| 型号： | MPC8379VRANG |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 10/117页 |
| 文件大小： | 0K |
| 描述： | MPU POWERQUICC II PRO 689-PBGA |
| 标准包装： | 27 |
| 系列： | MPC83xx |
| 处理器类型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 800MHz |
| 电压： | 1.05V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 689-BBGA 裸露焊盘 |
| 供应商设备封装： | 689-TEPBGA II（31x31） |
| 包装： | 托盘 |
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MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
107
The thermal resistance is expressed as the sum of a junction to case thermal resistance and a
case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction to ambient thermal resistance (°C/W)
RθJC = junction to case thermal resistance (°C/W)
RθCA = case to ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
This first-cut approach overestimates the heat sink size required, since heat flow through the board is not
accounted for, which can be as much as one-third to one-half of the power generated in the package.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling through the package and board and
the convection cooling due to the air moving through the application. Simplified thermal models of the
packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in
the thermal resistance table. More detailed thermal models can be made available on request.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because of the wide variety of
application environments, a single standard heat sink applicable to all cannot be specified.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8379VRANGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8379ZQAFDA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8379ZQAFFA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8379ZQAFGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8379ZQAGDA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
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