- 您现在的位置：买卖IC网 > PDF目录4089 > MPC8536BVTAULA (Freescale Semiconductor)MPU PWRQUICC III 1333MHZ 783PBGA PDF资料下载
参数资料
| 型号： | MPC8536BVTAULA |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 18/126页 |
| 文件大小： | 0K |
| 描述： | MPU PWRQUICC III 1333MHZ 783PBGA |
| 标准包装： | 1 |
| 系列： | MPC85xx |
| 处理器类型： | 32-位 MPC85xx PowerQUICC III |
| 速度： | 1.333GHz |
| 电压： | 1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 783-BBGA，FCBGA |
| 供应商设备封装： | 783-FCPBGA（29x29） |
| 包装： | 托盘 |
| 其它名称： | MPC8536BVTAUL MPC8536BVTAUL-ND |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页当前第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Hardware Design Considerations
Freescale Semiconductor
114
The heat sink removes most of the heat from the chip for most applications. Heat generated on the active side of the chip is
conducted through the silicon and through the heat sink attach material (or thermal interface material), and finally to the heat
sink. The junction-to-case thermal resistance is low enough that the heat sink attach material and heat sink thermal resistance
are the dominant terms.
2.24.3.2
Thermal Interface Materials
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal contact resistance. The
performance of thermal interface materials improves with increased contact pressure. This performance characteristic chart is
generally provided by the thermal interface vendors.
3
Hardware Design Considerations
This section provides electrical and thermal design recommendations for successful application of the chip.
3.1
System Clocking
This chip includes seven PLLs:
The platform PLL generates the platform clock from the externally supplied SYSCLK input. The frequency ratio
between the platform and SYSCLK is selected using the platform PLL ratio configuration bits as described in
The e500 core PLL generates the core clock as a slave to the platform clock. The frequency ratio between the e500
core clock and the platform clock is selected using the e500 PLL ratio configuration bits as described in Section 2.23.3,
The PCI PLL generates the clocking for the PCI bus
The local bus PLL generates the clock for the local bus.
There is a PLL for the SerDes1 block to be used for PCI Express interface
There is a PLL for the SerDes2 block to be used for SGMII and SATA interfaces.
The DDR PLL generates the DDR clock from the externally supplied DDRCLK input in asynchronous mode. The
frequency ratio between the DDR clock and DDRCLK is described in Section 2.23.4, “DDR/DDRCLK PLL Ratio.”
3.2
Power Supply Design and Sequencing
3.2.1
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins (AVDD_PLAT, AVDD_CORE,
AVDD_PCI, AVDD_LBIU, and AVDD_SRDS respectively). The AVDD level should always be equivalent to VDD, and
preferably these voltages will be derived directly from VDD through a low frequency filter scheme such as the following.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to provide independent
filter circuits per PLL power supply as illustrated in Figure 75, one to each of the AVDD pins. By providing independent filters
to each PLL the opportunity to cause noise injection from one PLL to the other is reduced.
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz range. It should be built
with surface mount capacitors with minimum Effective Series Inductance (ESL). Consistent with the recommendations of Dr.
Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors
of equal value are recommended over a single large value capacitor.
Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize noise coupled from
nearby circuits. It should be possible to route directly from the capacitors to the AVDD pin, which is on the periphery of 783
FC-PBGA the footprint, without the inductance of vias.
相关PDF资料 |
PDF描述 |
|---|---|
| MPC8265ACZUMIBC | IC MPU POWERQUICC II 480-TBGA |
| MPC8536ECVTATHA | MPU PWRQUICC III 1250MHZ 783PBGA |
| IDT70V05L55J8 | IC SRAM 64KBIT 55NS 68PLCC |
| IDT7005L55J8 | IC SRAM 64KBIT 55NS 68PLCC |
| IDT71342SA20PF | IC SRAM 32KBIT 20NS 64TQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8536BVTAVL | 功能描述:微处理器 - MPU 8536 INDUSTRIAL 1500 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8536BVTAVLA | 功能描述:微处理器 - MPU 8536 Non E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8536CVTAKG | 功能描述:微处理器 - MPU 8536 INDUSTRIAL 600 EXT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8536CVTAKGA | 功能描述:微处理器 - MPU 8536 Non E Ext Temp RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8536CVTANG | 功能描述:微处理器 - MPU 8536 INDUSTRIAL 800 EXT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。