参数资料
型号: MPC8541VTAPF
厂商: Freescale Semiconductor
文件页数: 61/88页
文件大小: 0K
描述: IC MPU POWERQUICC III 783-FCPBGA
产品培训模块: MPC8544E PowerQUICC™ III
标准包装: 36
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 833MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 783-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
配用: CWH-PPC-8540N-VE-ND - KIT EVAL SYSTEM MPC8540
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
64
Freescale Semiconductor
Clocking
15 Clocking
This section describes the PLL configuration of the MPC8541E. Note that the platform clock is identical
to the CCB clock.
15.1
Clock Ranges
Table 44 provides the clocking specifications for the processor core and Table 44 provides the clocking
specifications for the memory bus.
Table 44. Processor Core Clocking Specifications
Characteristic
Maximum Processor Core Frequency
Unit Notes
533 MHz
600 MHz
667 MHz
833 MHz
1000 MHz
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
e500 core
processor
frequency
400
533
400
600
400
667
400
833
400
1000
MHz 1, 2, 3
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to Section 15.2, “Platform/System PLL Ratio,” and Section 15.3, “e500 Core PLL Ratio,” for ratio settings.
2.)The minimum e500 core frequency is based on the minimum platform frequency of 200 MHz.
3. 1000 MHz frequency supports only a 1.3 V core.
Table 45. Memory Bus Clocking Specifications
Characteristic
Maximum Processor Core
Frequency
Unit
Notes
533, 600, 667, 883, 1000 MHz
Min
Max
Memory bus frequency
100
166
MHz
1, 2, 3
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that
the resulting SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their
respective maximum or minimum operating frequencies. Refer to Section 15.2, “Platform/System PLL
Ratio,” and Section 15.3, “e500 Core PLL Ratio,” for ratio settings.
2. The memory bus speed is half of the DDR data rate, hence, half of the platform clock frequency.
3. 1000 MHz frequency supports only a 1.3 V core.
相关PDF资料
PDF描述
IDT71342SA25J IC SRAM 32KBIT 25NS 52PLCC
IDT7143SA25PF8 IC SRAM 32KBIT 25NS 100TQFP
MPC8280CVVQLDA IC MPU POWERQUICC II 480-TBGA
AM1808BZWT4 IC ARM9 MPU 361NFBGA
IDT7133SA25PF8 IC SRAM 32KBIT 25NS 100TQFP
相关代理商/技术参数
参数描述
MPC8541VTAQF 功能描述:IC MPU POWERQUICC III 783-FCPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC85xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA,FCBGA 供应商设备封装:783-FCPBGA(29x29) 包装:托盘
MPC8543ECHXAQG 功能描述:微处理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8543ECPXAQGB 功能描述:微处理器 - MPU FG PQ38 8548 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8543ECPXAQGD 功能描述:微处理器 - MPU PQ38 PB XT WE 1000 R3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8543EHXANG 功能描述:微处理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324