参数资料
型号: MPC8548VUAVJA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1500 MHz, MICROPROCESSOR, CBGA783
封装: 29 X 29 MM, 1 MM PITCH, FLIP CHIP, LEAD FREE, CERAMIC, BGA-783
文件页数: 129/142页
文件大小: 1504K
代理商: MPC8548VUAVJA
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
87
Package Description
18.2
Mechanical Dimensions of the HiCTE FC-CBGA and FC-PBGA
with Full Lid
Figure 55 shows the mechanical dimensions and bottom surface nomenclature for both the MPC8548E
HiCTE FC-CBGA and FC-PBGA package with full lid.
Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature of the HiCTE
FC-CBGA and FC-PBGA with Full Lid
Notes:
1. All d
imensions are in millimeters.
2. Dimensioning and tolerancing per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. All dimensions are symmetric across the package center lines unless dimensioned otherwise.
7. Package code summary:
PBGA 8423
CBGA 5112
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