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参数资料
| 型号： | MPC855TZQ80D4 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/78页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC 80MHZ 357PBGA |
| 标准包装： | 44 |
| 系列： | MPC8xx |
| 处理器类型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 80MHz |
| 电压： | 3.3V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 357-BBGA |
| 供应商设备封装： | 357-PBGA（25x25） |
| 包装： | 托盘 |
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MPC860 PowerQUICC Family Hardware Specifications, Rev. 9
14
Freescale Semiconductor
Layout Practices
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40 gauge
type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over 1 mm of wire extending from the junction. The thermocouple wire is
placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
7.6
References
Semiconductor Equipment and Materials International
(415) 964-5111
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) Specifications
800-854-7179 or
(Available from Global Engineering Documents)
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999,
pp. 212–220.
8
Layout Practices
Each V
DD pin on the MPC860 should be provided with a low-impedance path to the board’s supply. Each
GND pin should likewise be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on the chip. The VDD power supply should be bypassed to ground using at least
four 0.1 F-bypass capacitors located as close as possible to the four sides of the package. The capacitor
leads and associated printed circuit traces connecting to chip VDD and GND should be kept to less than half
an inch per capacitor lead. A four-layer board employing two inner layers as VCC and GND planes is
recommended.
All output pins on the MPC860 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize undershoot and reflections caused by these fast output
switching times. This recommendation particularly applies to the address and data buses. Maximum PC
trace lengths of 6 inches are recommended. Capacitance calculations should consider all device loads as
well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes
especially critical in systems with higher capacitive loads because these loads create higher transient
currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs during reset.
Special care should be taken to minimize the noise levels on the PLL supply pins.
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