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参数资料
型号： MPC8560PXAPDB
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
封装： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件页数： 101/108页
文件大小： 2170K
代理商： MPC8560PXAPDB
MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1
92
Freescale Semiconductor
Thermal
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
16.2.4 Heat Sink Selection Examples
The following section provides a heat sink selection example using one of the commercially available heat sinks.
16.2.4.1Case 1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + TR + (θJC + θINT + θSA) × PD
where
TJ is the die-junction temperature
TI is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the adhesive or interface material thermal resistance
θ
SA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device
During operation the die-junction temperatures (TJ) should be maintained within the range specified in Table 2. The
temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TA) may range from 30°
to 40
°C. The air temperature rise within a cabinet (T
R) may be in the range of 5° to 10°C. The thermal resistance of
some thermal interface material (
θ
INT) may be about 1°C/W. Assuming a TI of 30°C, a TR of 5°C, a FC-PBGA
package
θ
JC = 0.8, and a power consumption (PD) of 7.0 W, the following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.8°C/W + 1.0°C/W + θSA) × 7.0 W
The heat sink-to-ambient thermal resistance (
θ
SA) versus airflow velocity for a Thermalloy heat sink #2328B is
shown in Figure 55.
Assuming an air velocity of 2 m/s, we have an effective
θ
SA+ of about 3.3°C/W, thus
TJ = 30°C + 5°C + (0.8°C/W +1.0°C/W + 3.3°C/W) × 7.0 W,
resulting in a die-junction temperature of approximately 71°C which is well within the maximum operating
temperature of the component.
相关PDF资料
PDF描述
MPC8560PXALDB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8560CPXALFB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC866PCZP100 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256
MPC866TCZP100 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256
MPC866TZP133A 32-BIT, 133 MHz, RISC PROCESSOR, PBGA357
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