参数资料
型号: MPC8567VTAUJJ
厂商: Freescale Semiconductor
文件页数: 109/139页
文件大小: 0K
描述: MPU POWERQUICC III 1023-PBGA
标准包装: 1
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 1.333GHz
电压: 1.1V
安装类型: 表面贴装
封装/外壳: 1023-BBGA,FCBGA
供应商设备封装: 1023-FCPBGA(33x33)
包装: 托盘
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
71
PCI Express
14.3
Clocking Dependencies
The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm)
of each other at all times. This is specified to allow bit rate clock sources with a +/– 300 ppm tolerance.
14.4
Physical Layer Specifications
The following is a summary of the specifications for the physical layer of PCI Express on this device. For
further details as well as the specifications of the Transport and Data Link layer please use the PCI
EXPRESS Base Specification. REV. 1.0a document.
14.4.1
Differential Transmitter (TX) Output
Table 51 defines the specifications for the differential output at all transmitters (TXs). The parameters are
specified at the component pins.
tREFPJ
Phase jitter. Deviation in edge location with respect to mean
edge location
–50
50
ps
Notes:
1. Typical based on PCI Express Specification 2.0.
Table 51. Differential Transmitter (TX) Output Specifications
Symbol
Parameter
Min
Nom
Max
Units
Comments
UI
Unit Interval
399.88
400
400.12
ps
Each UI is 400 ps ± 300 ppm. UI does not account for
Spread Spectrum Clock dictated variations. See Note 1.
VTX-DIFFp-p
Differential
Peak-to-Peak
Output Voltage
0.8
1.2
V
VTX-DIFFp-p = 2*|VTX-D+ – VTX-D-| See Note 2.
VTX-DE-RATIO
De- Emphasized
Differential
Output Voltage
(Ratio)
–3.0
–3.5
–4.0
dB
Ratio of the VTX-DIFFp-p of the second and following bits
after a transition divided by the VTX-DIFFp-p of the first bit
after a transition. See Note 2.
TTX-EYE
Minimum TX Eye
Width
0.70
UI
The maximum Transmitter jitter can be derived as
TTX-MAX-JITTER = 1 – TTX-EYE= 0.3 UI.
See Notes 2 and 3.
TTX-EYE-MEDIAN-to-
MAX-JITTER
Maximum time
between the jitter
median and
maximum
deviation from
the median.
0.15
UI
Jitter is defined as the measurement variation of the
crossing points (VTX-DIFFp-p = 0 V) in relation to a
recovered TX UI. A recovered TX UI is calculated over
3500 consecutive unit intervals of sample data. Jitter is
measured using all edges of the 250 consecutive UI in
the center of the 3500 UI used for calculating the TX UI.
See Notes 2 and 3.
TTX-RISE, TTX-FALL
D+/D- TX Output
Rise/Fall Time
0.125
UI
See Notes 2 and 5
Table 50. SD_REF_CLK and SD_REF_CLK AC Requirements
Symbol
Parameter Description
Min
Typical
Max
Units
Notes
相关PDF资料
PDF描述
IDT70V9179L9PF8 IC SRAM 288KBIT 9NS 100TQFP
MPC8543ECPXAQGB MPU POWERQUICC III 783-PBGA
MPC8266AZUPJDC IC MPU POWERQUICC II 480-TBGA
ACB108DHAD CONN EDGECARD 216PS R/A .050 DIP
MC68EN360CRC25L IC MPU QUICC 32BIT 25MHZ 241-PGA
相关代理商/技术参数
参数描述
MPC8568ECVTAQGG 功能描述:微处理器 - MPU 8568 1GHz Pb Free RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8568E-MDS-PB 功能描述:开发板和工具包 - 其他处理器 MPC8568E FAMILY ADS RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC8568EPXAQGG 功能描述:微处理器 - MPU 8568 PB Encrypt 1GHz RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8568EPXAUJJ 功能描述:微处理器 - MPU 8568 PB Encrypt 1.3GHz RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8568EVTAQGG 功能描述:微处理器 - MPU No PB 1.0 GHz RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324