参数资料
型号: MPC8569EVTANKGA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783
文件页数: 18/126页
文件大小: 2847K
代理商: MPC8569EVTANKGA
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
TDM/SI
Freescale Semiconductor
114
The following figure provides the AC test load for the TDM/SI.
Figure 67. TDM/SI AC Test Load
The below figure represents the AC timing from Table 76. Note that although the specifications generally reference the rising
edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. The following figure shows the
TDM/SI timing with external clock.
Figure 68. TDM/SI AC Timing (External Clock) Diagram
Table 76. TDM/SI AC Timing Specifications1
Characteristic
Symbol2
Min
Max
Unit
TDM/SI outputs—External clock delay
tSEKHOV
211
ns
TDM/SI outputs—External clock High Impedance
tSEKHOX
210
ns
TDM/SI inputs—External clock input setup time
tSEIVKH
5—
ns
TDM/SI inputs—External clock input hold time
tSEIXKH
2—
ns
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are
measured at the pin.
2. The symbols used for timing specifications follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSEKHOX symbolizes the TDM/SI outputs
external timing (SE) for the time tTDM/SI memory clock reference (K) goes from the high state (H) until outputs (O) are invalid
(X).
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω
TDM/SICLK (Input)
tSEIXKH
tSEIVKH
tSEKHOV
Input Signals:
TDM/SI
(See Note)
Output Signals:
TDM/SI
(See Note)
tSEKHOX
Note: The clock edge is selectable on TDM/SI.
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