- 您现在的位置：买卖IC网 > PDF目录4100 > MPC860TVR80D4 (Freescale Semiconductor)IC MPU POWERQUICC 80MHZ 357PBGA PDF资料下载
参数资料
| 型号： | MPC860TVR80D4 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/78页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC 80MHZ 357PBGA |
| 标准包装： | 44 |
| 系列： | MPC8xx |
| 处理器类型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 80MHz |
| 电压： | 3.3V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 357-BBGA |
| 供应商设备封装： | 357-PBGA（25x25） |
| 包装： | 托盘 |
第1页第2页第3页第4页第5页当前第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页
MPC860 PowerQUICC Family Hardware Specifications, Rev. 9
14
Freescale Semiconductor
Layout Practices
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40 gauge
type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over 1 mm of wire extending from the junction. The thermocouple wire is
placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
7.6
References
Semiconductor Equipment and Materials International
(415) 964-5111
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) Specifications
800-854-7179 or
(Available from Global Engineering Documents)
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999,
pp. 212–220.
8
Layout Practices
Each V
DD pin on the MPC860 should be provided with a low-impedance path to the board’s supply. Each
GND pin should likewise be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on the chip. The VDD power supply should be bypassed to ground using at least
four 0.1 F-bypass capacitors located as close as possible to the four sides of the package. The capacitor
leads and associated printed circuit traces connecting to chip VDD and GND should be kept to less than half
an inch per capacitor lead. A four-layer board employing two inner layers as VCC and GND planes is
recommended.
All output pins on the MPC860 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize undershoot and reflections caused by these fast output
switching times. This recommendation particularly applies to the address and data buses. Maximum PC
trace lengths of 6 inches are recommended. Capacitance calculations should consider all device loads as
well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes
especially critical in systems with higher capacitive loads because these loads create higher transient
currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs during reset.
Special care should be taken to minimize the noise levels on the PLL supply pins.
相关PDF资料 |
PDF描述 |
|---|---|
| IDT71V65803S100BG8 | IC SRAM 9MBIT 100MHZ 119BGA |
| 1-84953-9 | CONN FPC 19POS 1MM RT ANG SMD |
| MPC860TZQ80D4 | IC MPU POWERQUICC 80MHZ 357PBGA |
| IDT71V65703S85BG8 | IC SRAM 9MBIT 85NS 119BGA |
| IDT71V65703S80BG8 | IC SRAM 9MBIT 80NS 119BGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC860TZQ50D4 | 功能描述:微处理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC860TZQ50D4R2 | 功能描述:微处理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC860TZQ66D4 | 功能描述:微处理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC860TZQ80D4 | 功能描述:微处理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC860TZQ80D4 | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 80MHZ 357-PBGA |
发布紧急采购，3分钟左右您将得到回复。