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参数资料
| 型号： | MPC870VR80 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 80 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | LEAD FREE, PLASTIC, BGA-256 |
| 文件页数： | 2/84页 |
| 文件大小： | 1042K |
| 代理商： | MPC870VR80 |
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MPC875/MPC870 PowerQUICC Hardware Specifications, Rev. 4
10
Freescale Semiconductor
Thermal Characteristics
This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for example, either GND or VDDH).
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC875/MPC870.
Table 3. Operating Temperatures
Rating
Symbol
Value
Unit
Temperature 1 (standard)
1 Minimum temperatures are guaranteed as ambient temperature, T
A. Maximum temperatures are guaranteed as junction
temperature, TJ.
TA(min)
0°C
TJ(max)
95
°C
Temperature (extended)
TA(min)
–40
°C
TJ(max)
100
°C
Table 4. MPC875/MPC870 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
43
°C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal.
29
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
3
36
Four-layer board (2s2p)
RθJMA
3
26
Junction-to-board4
4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RθJB
20
Junction-to-case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages where
the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to the
exposed pad without contact resistance.
RθJC
10
Junction-to-package top6
6 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
Natural convection
ΨJT
2
Airflow (200 ft/min)
ΨJT
2
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