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| 型号： | MPC961CFAR2 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 961 SERIES, PLL BASED CLOCK DRIVER, 17 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32 |
| 封装： | PLASTIC, LQFP-32 |
| 文件页数： | 7/9页 |
| 文件大小： | 343K |
| 代理商： | MPC961CFAR2 |
5
MPC961C
MOTOROLA ADVANCED CLOCK DRIVERS DEVICE DATA
483
Table 8: Confidence Facter CF
CF
Probability of clock edge within the distribution
± 1s
0.68268948
± 2s
0.95449988
± 3s
0.99730007
± 4s
0.99993663
± 5s
0.99999943
± 6s
0.99999999
The feedback trace delay is determined by the board layout
and can be used to fine-tune the effective delay through each
device. In the following example calculation a I/O jitter confi-
dence factor of 99.7% (
± 3s) is assumed, resulting in a worst
case timing uncertainty from input to any output of -275 ps to
315 ps relative to CCLK:
tSK(PP) =
[–80ps...120ps] + [–150ps...150ps] +
[(15ps
@ –3)...(15ps @ 3)] + tPD, LINE(FB)
tSK(PP) =
[–275ps...315ps] + tPD, LINE(FB)
Due to the frequency dependence of the I/O jitter, Figure 8
“Max. I/O Jitter versus frequency” can be used for a more pre-
cise timing performance analysis.
Figure 8. Max. I/O Jitter versus frequency
Power Consumption of the MPC961C and Thermal Man-
agement
The MPC961C AC specification is guaranteed for the entire
operating frequency range up to 200 MHz. The MPC961C
power consumption and the associated long-term reliability
may decrease the maximum frequency limit, depending on op-
erating conditions such as clock frequency, supply voltage,
output loading, ambient temperature, vertical convection and
thermal conductivity of package and board. This section de-
scribes the impact of these parameters on the junction temper-
ature and gives a guideline to estimate the MPC961C die junc-
tion temperature and the associated device reliability. For a
complete analysis of power consumption as a function of oper-
ating conditions and associated long term device reliability
please refer to the application note AN1545. According the
AN1545, the long-term device reliability is a function of the die
junction temperature:
Table 9: Die junction temperature and MTBF
Junction temperature (
°C)
MTBF (Years)
100
20.4
110
9.1
120
4.2
130
2.0
Increased power consumption will increase the die junction
temperature and impact the device reliability (MTBF). Accord-
ing to the system-defined tolerable MTBF, the die junction tem-
perature of the MPC961C needs to be controlled and the ther-
mal impedance of the board/package should be optimized.
The power dissipated in the MPC961C is represented in equa-
tion 1.
Where ICCQ is the static current consumption of the
MPC961C, CPD is the power dissipation capacitance per out-
put,
(Μ)ΣCL represents the external capacitive output load, N
is the number of active outputs (N is always 27 in case of the
MPC961C). The MPC961C supports driving transmission
lines to maintain high signal integrity and tight timing parame-
ters. Any transmission line will hide the lumped capacitive load
at the end of the board trace, therefore,
ΣCL is zero for con-
trolled transmission line systems and can be eliminated from
equation 1. Using parallel termination output termination re-
sults in equation 2 for power dissipation.
In equation 2, P stands for the number of outputs with a
parallel or thevenin termination, VOL, IOL, VOH and IOH are a
function of the output termination technique and DCQ is the
clock signal duty cyle. If transmission lines are used
ΣCL is
zero in equation 2 and can be eliminated. In general, the use of
controlled transmission line techniques eliminates the impact
of the lumped capacitive loads at the end lines and greatly
reduces the power dissipation of the device. Equation 3 de-
scribes the die junction temperature TJ as a function of the
power consumption.
P
TOT +
I
CCQ ) VCC @ fCLOCK @
N
@ C
PD )
M
CL
@ V
CC
Equation 1
P
TOT + VCC @
I
CCQ ) VCC @ fCLOCK @
N
@ C
PD )
M
CL
)
P
DC
Q @ IOH @ VCC * VOH ) 1 * DCQ @ IOL @ VOL
Equation 2
TJ + TA ) PTOT @ Rthja
Equation 3
f
CLOCK,MAX +
1
CPD @ N @ V2
CC
@
T
J,MAX * TA
R
thja
* I
CCQ @ VCC
Equation 4
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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