参数资料
型号: MPC9817ENR2
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟产生/分配
英文描述: 66 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO20
封装: LEAD FREE, SSOP-20
文件页数: 7/8页
文件大小: 97K
代理商: MPC9817ENR2
Advanced Clock Drivers Devices
Freescale Semiconductor
7
MPC9817
PACKAGE DIMENSIONS
.337
.150
1
10
11
20
B
PIN 1 ID
4
5
D
.157
.344
4
.236
.118
.010
C
A-B
D
2X 10 TIPS
BB
5
.003
H
A-B
D
2X
A
4
.035
SECTION B-B
R.003 MIN
.0098
.0040
.016
0
8
0
.010
GAUGE PLANE
MIN
8
6
.004 C
.055
SEATING
PLANE
.025
C
20X
18X
.061
.0125
CL
H
3
7
A
(.010)
.012
.010
(.008)
PLATING
BASE METAL
SECTION A-A
.007
.008
M
.007
C A-B D
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
DIMENSIONS ARE IN INCHES.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DATUM PLANE H LOCATED AT MOLD PARTING
LINE AND COINCIDENT WITH LEAD, WHERE
LEAD EXITS PLASTIC BODY AT BOTTOM OF
PARTING LINE.
DATUM A, B AND D TO BE DETRMINED WHERE
CENTERLINE BETWEEN LEADS EXITS PLASTIC
BODY AT DATUM PLANE H.
THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH OR PROTRUSIONS, BUT DO INCLUDE
MOLD MISMATCH AND ARE MEASURED AT THE
MOLD PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED .006
INCHES FOR ENDS AND .008 INCHES FOR
SIDES.
THIS DIMENSION IS LENGTH OF TERMINAL FOR
SOLDERING A SUBSTRATE.
FORMED LEADS SHALL BE PLANAR WITH
RESPECT TO ONE ANOTHER WITHIN .004
INCHES AT SEATING PLANE.
THIS DIMENSION IS DEFINED AS THE DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT OF THE PACKAGE BODY.
CASE 1461-02
ISSUE O
20 SSOP PACKAGE
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