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参数资料
| 型号： | MPD6D128S |
| 厂商： | MURATA MANUFACTURING CO LTD |
| 元件分类： | 电源模块 |
| 英文描述： | CONV DC/DC 30W 5.0VOUT 6A SMT |
| 中文描述： | 1-OUTPUT 30 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | MODULE-29 |
| 文件页数： | 16/16页 |
| 文件大小： | 240K |
| 代理商： | MPD6D128S |
Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’ s specifications are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
specifications or transact the approval sheet for product specifications before ordering.
2010.5.7
MPD6D12*S Specification
9
9.3. Reliability
9.3.1. Humidity Test
Parts are subjected to a temperature 40°C}
2°C with 90`
95% for 100 hours.
Return the parts to room temperature (25°C) for 4 hours and measure. The initial values under item
9-1 should be met. (JIS-C-0022)
9.3.2. Thermal Cycle Test
Parts are subjected to 5 cycle of the following.
The parts are placed in room temperature (25°C) for 2 hours and are measured.
The initial values under item 9-1 should be met.
Step
Condition
Time
1
-40}
3°C
30 minutes
2
Room Temp.
5`
10 minutes
3
+85}
3°C
30 minutes
4
Room Temp.
5`
10 minutes
9.3.3. Vibration
10 to 55Hz, 1.5mm amplitude, 1 hour for each each of X,Y,Z directions.
No damage in appearance and no deviation from electrical characteristics(9-1).
9.3.4. Mechanical Shock
20G, 1 time for each X,Y,Z directions.
No damage in appearance and no deviation from electrical characteristics(9-1).
9.3.5. Soldering Heat Resistance
Immerse the part of lead where it is to be soldered on a motherboard in a solder bath of 260}
5°C
for 3}
0.5s.
Then tested products are left for 2 hours.
There is no damage in appearance and no deviation from electrical characteristics in clause 9.
9.3.6. Lead Pin Strength
Strain a lead pin by gradual-increasingly 5.0N along axial direction; withstand for 5s.
No damage on a lead pin.
9.3.7. Solderability of Leads
The lead pins will be immersed in the Isopropyl Alcohol (JIS K 1522) with Rosin (JIS K 5902) solution
(the concentration of Rosin will be allowed 10wt% to 35wt%, and normally approx.25wt% will be used
without any specific requirement.). Then the lead pins will be immersed in the solder H63A (JIS Z 3282)
solution at the temperature of 230°C}
5°C for 3}
0.5seconds, and pulled up completely. The solder will
adhere to over 75% of immersed area.
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