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参数资料
| 型号： | MPD6D128S |
| 厂商： | MURATA MANUFACTURING CO LTD |
| 元件分类： | 电源模块 |
| 英文描述： | CONV DC/DC 30W 5.0VOUT 6A SMT |
| 中文描述： | 1-OUTPUT 30 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | MODULE-29 |
| 文件页数： | 6/16页 |
| 文件大小： | 240K |
| 代理商： | MPD6D128S |
Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’ s specifications are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
specifications or transact the approval sheet for product specifications before ordering.
2010.5.7
MPD6D12*S Specification
14
12. Notice
12.1. Soldering
12.1.1. Flux
Please solder this product with Rosin Flux, which contains of 0.2wt%. or less chlorine.
Please do not use high activity acid flux or water soluble flux because they may erode metal or glass
portion of this product and may cause defectiveness or deterioration of this product.
12.1.2. Solder
Please use the solder H60, H63(JIS Z3282)or the equivalent type.
Please use the solder paste of equivalent type H60, H63.
12.1.3. Condition of Soldering
Reflow Solder
Reflow Soldering Profiles
JEDEC IPC/JEDEC J-STD-020D
Table 5-2 Classification Reflow Profiles
Pb-Free Assembly Large Body
Profile details
Soldering temperature
F 245 C +0/-5
Soldering time
F 30 seconds,240`
245 C
Heating time
F 60`
150 seconds,217 C or more.
Preheating time
F 60`
120seconds,150`
200 C
Programming rate
F 3 C /sec.Max.,217`
245 C
Descending rate
F 6 C /sec.Max.
Total soldering time
F 8 minutes Max.,25`
245 C
Time
F Max 2 times.
Do not give vibration or an airing to product while solder melts under reflow process.
Please wait for products cooled down enough.
There is the possibility that products which are mounted on back side of motherboard
may fall down from the motherboard while reflow process.
Recommend to use supplemental mechanical contact to pins where is located at four
corners, by other adhesive methods, for example, a thermal setting resin, rather than
soldering.
12.2.
Cleaning
12.2.1. Please clean the products to remove flux by using the dip, boil, and vapor methods in isopropyl
alcohol for up to 5 minutes.
Please inform us if you are to use aqueous or semi-aqueous cleaning or other methods.
Do not use ultrasonic cleaning because semiconductor device on the products may be
damaged by resonance.
12.2.2. After cleaning, please dry the products thoroughly. If you touch the wet products ,the
marking on the products may be erased or blurred.
Do not measure electrical characteristics, until the products get dried enough.
12.2.3. If you don’t clean the products with no-cleaning type flux, you must confirm the
reliability of the products fully in advance.
Isolated DC-DC Converter
Motherboard
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