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参数资料
型号： MPM21CUB450B
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 450 MHz, MICROPROCESSOR, XMA
封装： MMC-2
文件页数： 45/64页
文件大小： 826K
代理商： MPM21CUB450B
243357-005
Datasheet
v
Celeron
Processor Mobile Module MMC-2
at 700 MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
21
82443BX Thermal Transfer Plate (Reference Only) ........................................... 52
22
82443BX Thermal Transfer Plate Detail.............................................................. 52
23
CPU Thermal Transfer Plate (Reference Only)................................................... 53
24
Standoff Holes, Board Edge Clearance, and EMI Containment Ring ................. 54
25
Product Tracking Code........................................................................................ 57
Tables
1
Connector Signal Summary .................................................................................. 4
2
Memory Signals..................................................................................................... 5
3
AGP Signal Descriptions ....................................................................................... 6
4
PCI Signal Description .......................................................................................... 8
5
Processor and PIIX4E/M Sideband Signal Description....................................... 10
6
Power Management Signal Descriptions ............................................................ 11
7
Clock Signal Definitions....................................................................................... 12
8
Voltage Descriptions ........................................................................................... 13
9
ITP and JTAG Pins.............................................................................................. 14
10
Miscellaneous Pins.............................................................................................. 14
11
Connector Pin Assignment..................................................................................15
12
Connector Specifications..................................................................................... 18
13
Configuration Straps for the 82443BX Host Bridge System Controller ............... 20
14
Clock State Characteristics ................................................................................. 22
15
Power Consumption Values I ............................................................................. 26
16
Power Consumption Values II ............................................................................. 27
17
Power Consumption Values II ............................................................................. 27
18
BCLK DC Specifications...................................................................................... 28
19
BCLK AC Specifications at the Processor Core Pins.......................................... 28
20
BCLK Signal Quality AC Specifications at the Processor Core........................... 29
21
System Power Requirements.............................................................................. 30
22
Vcore Power Conversion Efficiency .................................................................... 31
23
Voltage Signal Definitions and Sequences ......................................................... 33
24
VR_ON In-rush Current....................................................................................... 34
25
Bulk Capacitance Requirements ......................................................................... 35
26
Thermal Sensor SMBus Address ........................................................................ 48
27
Thermal Sensor Configuration Register .............................................................. 48
28
Thermal Design Power (TDP MODULE ) Specification ...................................... 55
29
Environmental Standards .................................................................................... 58
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