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参数资料
| 型号： | MPM21CUB450B |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 450 MHz, MICROPROCESSOR, XMA |
| 封装： | MMC-2 |
| 文件页数： | 58/64页 |
| 文件大小： | 826K |
| 代理商： | MPM21CUB450B |
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Celeron
Processor Mobile Module MMC-2
at 700 MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
243357-005
Datasheet
55
7.0
Thermal Specification
7.1
Thermal Design Power
The power handling capability of the system thermal solution may be reduced to less than the
recommended typical Thermal Design Power (TDP) as shown in Table 28 with the implementation
of firmware/software control or "throttling” that reduces the CPU power consumption and
dissipation. The typical TDP is the typical power dissipation under normal operating conditions at
nominal V_CORE (CPU power supply) while executing the worst case power instruction mix. This
includes the power dissipated by all of the relevant components. During all operating
environments, the processor junction temperature, TJ, must be within the specified range of 0
° C to
100
° C.
Table 28. Thermal Design Power (TDP MODULE ) Specification
NOTES:
1. During all operating environments, the processor temperature, Tj, must be within the special range of 0 °C to
100
°C.
2. TDPModule is a thermal solution design reference point for thermal solution readiness for total module power.
3. Module equals core + 82443BX + VR.
Symbol
Typical
700 MHz
Typical
650 MHz
Typical
600 MHz
Typical
450 MHz
Typical
500 MHz
Typical
550 MHz
TDP Module
19.1W
17.8W
16.6W
14.1W
15.0W
15.4W
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相关代理商/技术参数 |
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