参数资料
型号: MRF6V3090NR1
厂商: Freescale Semiconductor
文件页数: 10/19页
文件大小: 942K
描述: FET RF N-CH 860MHZ 50V TO270-4
标准包装: 1
晶体管类型: LDMOS
频率: 860MHz
增益: 22dB
电压 - 测试: 50V
电流 - 测试: 350mA
功率 - 输出: 18W
电压 - 额定: 110V
封装/外壳: TO-270AB
供应商设备封装: TO-270 WB-4
包装: 标准包装
其它名称: MRF6V3090NR1DKR
18
RF Device Data
Freescale Semiconductor, Inc.
MRF6V3090NR1 MRF6V3090NR5
MRF6V3090NBR1 MRF6V3090NBR5
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following documents, software and tools to aid your design process.
Application Notes
?
AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages
?
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
?
AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages
?
AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
?
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
?
Electromigration MTTF Calculator
?
RF High Power Model
?
.s2p File
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the ?Part Number? link. Go to the
Software & Tools tab on the part?s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Apr. 2010
?
Initial Release of Data Sheet
1
Dec. 2011
?
Changed ?DVB--T OFDM? to ?DVB--T (8k OFDM)? throughout
?
Fig. 6, CW Output Power versus Input Power: corrected typographical error in dBm to watts conversion
values,p.5
?
Fig. 7, CW Power Gain versus Output Power (Narrowband
Test Circuit): adjusted x--axis scale from 0 to
140 watts to 10 to 150 watts, p. 5
?
Updated Fig. 9, Intermodulation Distortion Products versus Output Power, to correct X--axis PEP power
values,p.6
?
Fig. 10, Intermodulation Distortion Products versus Two--Tone Spacing: added f = 860 MHz to graph
callouts, p. 6
?
Updated Fig. 11, Two--Tone Power Gain versus Output Power, to correct X--axis PEP power values, p. 6
?
Updated Fig. 12, Third Order Intermodulation Distortion versus Output Power, to correct X--axis PEP
power values, p. 6
?
Fig. 18, MTTF versus Junction Temperature -- CW: MTTF end temperature on graph changed to match
maximum operating junction temperature, p. 8
?
Fig. 19, Series Equivalent Source and Load Impedance: removed plot, p. 9
?
Added 470--860 MHz Broadband Reference Circuit frequency table, p. 9
?
Added Fig. 20, 470--860 MHz Broadband 2″×3″Compact Reference Circuit Component Layout, p. 9
?
Added Table 7, 470--860 MHz Broadband 2″×3″Reference Circuit Component Designations and Values,
p. 10
?
Added Fig. 21, Single--Carrier DVB--T (8k OFDM) Power Gain and Drain Efficiency versus Frequency
(Broadband Reference Circuit), p. 11
?
Added Fig. 22, Single--Carrier DVB--T (8k OFDM) Output PAR and IMD Shoulder versus Frequency
(Broadband Reference Circuit), p. 11
?
Added Fig. 23, Pulsed Power Gain and Drain Efficiency versus Output Power (Broadband Reference
Circuit),p.11
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