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参数资料
型号： MSC8103VT1100F
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 数字信号处理
英文描述： 64-BIT, 68.75 MHz, OTHER DSP, PBGA332
封装： 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332
文件页数： 17/104页
文件大小： 1810K
代理商： MSC8103VT1100F
MSC8103 Network Digital Signal Processor, Rev. 11
ii
Freescale Semiconductor
Table of Contents
MSC8103 Features .................................................................................................................................................................................... iii
Target Applications .....................................................................................................................................................................................iv
Product Documentation ..............................................................................................................................................................................iv
Chapter 1
Signals/Connections
1.1
Power Signals......................................................................................................................................................................... 1-4
1.2
Clock Signals ......................................................................................................................................................................... 1-4
1.3
Reset, Configuration, and EOnCE Event Signals .................................................................................................................. 1-5
1.4
System Bus, HDI16, and Interrupt Signals............................................................................................................................ 1-6
1.5
Memory Controller Signals ................................................................................................................................................. 1-13
1.6
CPM Ports............................................................................................................................................................................ 1-15
1.7
JTAG Test Access Port Signals............................................................................................................................................ 1-36
1.8
Reserved Signals .................................................................................................................................................................. 1-36
Chapter 2
Physical and Electrical Specifications
2.1
Absolute Maximum Ratings .................................................................................................................................................. 2-1
2.2
Recommended Operating Conditions .................................................................................................................................... 2-2
2.3
Thermal Characteristics ......................................................................................................................................................... 2-2
2.4
DC Electrical Characteristics................................................................................................................................................. 2-3
2.5
Clock Configuration............................................................................................................................................................... 2-4
2.6
AC Timings ............................................................................................................................................................................ 2-7
Chapter 3
Packaging
3.1
FC-PBGA Package Description............................................................................................................................................. 3-1
3.2
Lidded FC-PBGA Package Mechanical Drawing ............................................................................................................... 3-31
Chapter 4
Design Considerations
4.1
Thermal Design Considerations............................................................................................................................................. 4-1
4.2
Electrical Design Considerations........................................................................................................................................... 4-1
4.3
Power Considerations ............................................................................................................................................................ 4-2
4.4
Layout Practices..................................................................................................................................................................... 4-3
Ordering and Contact Information ............................................................................................................................... Back Cover
Data Sheet Conventions
pin and pin-
out
Although the device package does not have pins, the term pins and pin-out are used for
convenience and indicate specific signal locations within the ball-grid array.
OVERBAR
Used to indicate a signal that is active when pulled low (For example, the RESET pin is active
when low.)
“asserted”
Means that a high true (active high) signal is high or that a low true (active low) signal is low
“deasserted”
Means that a high true (active high) signal is low or that a low true (active low) signal is high
Examples:
Signal/Symbol
Logic State
Signal State
Voltage
PIN
True
Asserted
VIL/VOL
PIN
False
Deasserted
VIH/VOH
PIN
True
Asserted
VIH/VOH
PIN
False
Deasserted
VIL/VOL
Note:
Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
相关PDF资料
PDF描述
MSC8103M1200F 64-BIT, 75 MHz, OTHER DSP, PBGA332
MSC8144EC 0-BIT, 133 MHz, OTHER DSP, PBGA783
MSC8144E 0-BIT, 150 MHz, OTHER DSP, PBGA783
MSC8152TVT1000B RISC PROCESSOR, PBGA783
MSC8154ETVT1000B 0-BIT, OTHER DSP, PBGA783
相关代理商/技术参数
参数描述
MSC8103VT1200F 功能描述:IC DSP 16BIT 300MHZ 332-FCPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘
MSC81058 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81090 制造商:ASI 制造商全称:ASI 功能描述:NPN SILICON RF POWER TRANSISTOR
MSC81111 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81118 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
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