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参数资料
| 型号： | MSD1010LT3 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 小信号晶体管 |
| 英文描述： | 100 mA, 15 V, PNP, Si, SMALL SIGNAL TRANSISTOR |
| 封装： | SC-59, 3 PIN |
| 文件页数： | 13/21页 |
| 文件大小： | 292K |
| 代理商： | MSD1010LT3 |
Package Outline Dimensions
8–8
Motorola Small–Signal Transistors, FETs and Diodes Device Data
PACKAGE OUTLINE DIMENSIONS (continued)
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
17
14
8
B
A
F
HG
D
K
C
N
L
J
M
SEATING
PLANE
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.715
0.770
18.16
19.56
B
0.240
0.260
6.10
6.60
C
0.145
0.185
3.69
4.69
D
0.015
0.021
0.38
0.53
F
0.040
0.070
1.02
1.78
G
0.100 BSC
2.54 BSC
H
0.052
0.095
1.32
2.41
J
0.008
0.015
0.20
0.38
K
0.115
0.135
2.92
3.43
L
0.300 BSC
7.62 BSC
M
0
10
0
10
N
0.015
0.039
0.39
1.01
__
_
CASE 646–06
14–PIN DIP
PLASTIC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
9
16
K
PLANE
–T–
M
A
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
M
0
10
0
10
S
0.020
0.040
0.51
1.01
_
CASE 648–08
16–PIN DIP
PLASTIC
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