参数资料
型号: MSD1010LT3
厂商: ON SEMICONDUCTOR
元件分类: 小信号晶体管
英文描述: 100 mA, 15 V, PNP, Si, SMALL SIGNAL TRANSISTOR
封装: SC-59, 3 PIN
文件页数: 19/21页
文件大小: 292K
代理商: MSD1010LT3
Packaging Specifications
6–6
Motorola Small–Signal Transistors, FETs and Diodes Device Data
TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H
F1
F2
P2
P1
P
D
W
W1
L1
W2
H2B
T1
T
T2
H4 H5
H1
Figure 1. Device Positioning on Tape
L
Specification
Inches
Millimeter
Symbol
Item
Min
Max
Min
Max
D
Tape Feedhole Diameter
0.1496
0.1653
3.8
4.2
D2
Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
F1, F2
Component Lead Pitch
0.0945
0.110
2.4
2.8
H
Bottom of Component to Seating Plane
.059
.156
1.5
4.0
H1
Feedhole Location
0.3346
0.3741
8.5
9.5
H2A
Deflection Left or Right
0
0.039
0
1.0
H2B
Deflection Front or Rear
0
0.051
0
1.0
H4
Feedhole to Bottom of Component
0.7086
0.768
18
19.5
H5
Feedhole to Seating Plane
0.610
0.649
15.5
16.5
L
Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
L1
Lead Wire Enclosure
0.09842
2.5
P
Feedhole Pitch
0.4921
0.5079
12.5
12.9
P1
Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2
First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
T
Adhesive Tape Thickness
0.06
0.08
0.15
0.20
T1
Overall Taped Package Thickness
0.0567
1.44
T2
Carrier Strip Thickness
0.014
0.027
0.35
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
W1
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
相关PDF资料
PDF描述
MSD1010LT1 100 mA, 15 V, PNP, Si, SMALL SIGNAL TRANSISTOR
MMBT1010LT3 100 mA, 15 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
MSD1328-RT3 500 mA, 20 V, NPN, Si, SMALL SIGNAL TRANSISTOR
MSM60804GS-K4 PCMCIA BUS CONTROLLER, PQFP208
MSM6222B-XXGS-L 16 X 40 DOTS DOT MAT LCD DRVR AND DSPL CTLR, PQFP80
相关代理商/技术参数
参数描述
MSD1010T1 制造商:LRC 制造商全称:Leshan Radio Company 功能描述:Low Saturation Voltage
MSD104RM-489 制造商:BURNDY 功能描述:MSD104RM-489
MSD104RM811 制造商:SOURIAU 功能描述:
MSD106E 制造商:n/a 功能描述:ALCO S7B4A
MSD1112N MU454494MSD1 制造商:NSF (CONTROLS) 功能描述:SWITCH 1POLE 12 POS 制造商:NSF (CONTROLS) 功能描述:SWITCH, 1POLE, 12 POS 制造商:NSF (CONTROLS) 功能描述:SWITCH, 1POLE, 12 POS, No. of Poles:1, No. of Switch Positions:12, Angle of Throw:30, Contact Current AC Max:6A, Contact Current DC Max:10A, Contact Voltage AC Max:250V, Contact Voltage DC Max:30V, SVHC:No SVHC (20-Jun-2013), , RoHS Compliant: Yes