参数资料
型号: MSM6641E-XXGS-K
厂商: OKI ELECTRIC INDUSTRY CO LTD
元件分类: 微控制器/微处理器
英文描述: 4-BIT, MROM, 1.1 MHz, MICROCONTROLLER, PDSO24
封装: 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24
文件页数: 7/7页
文件大小: 96K
代理商: MSM6641E-XXGS-K
7/7
MSM6641/6641E-xx
Semiconductor
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP24-P-430-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Mirror finish
相关PDF资料
PDF描述
MSM6641-XXGS-K 4-BIT, MROM, 1.1 MHz, MICROCONTROLLER, PDSO24
MSM82C88-2JS 8 MHz, CONTROL AND CMD SIG GEN, PQCC20
MSP1N6624US 1.5 A, SILICON, RECTIFIER DIODE
MSP3V3-M3/89A 100 W, UNIDIRECTIONAL, SILICON, TVS DIODE
MSP50C614 0-BIT, 8 MHz, MIXED DSP, UUC85
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