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参数资料
型号： MSP430FG4270IDL
厂商： TEXAS INSTRUMENTS INC
元件分类： 微控制器/微处理器
英文描述： 16-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDSO48
封装： GREEN, PLASTIC, SSOP-48
文件页数： 55/66页
文件大小： 1391K
代理商： MSP430FG4270IDL
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
MSP430FG4250IDL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430FG4250IDLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430FG4250IRGZR
ACTIVE
VQFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FG4250IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FG4260IDL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430FG4260IDLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430FG4260IRGZR
ACTIVE
VQFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FG4260IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FG4270IDL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430FG4270IDLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430FG4270IRGZR
ACTIVE
VQFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FG4270IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
Addendum-Page 1
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相关代理商/技术参数
参数描述
MSP430FG4270IDLR 功能描述:16位微控制器 - MCU 16-Bit 32kB Flash 256 RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430FG4270IRGZR 功能描述:16位微控制器 - MCU 16-Bit 32kB Flash 256K RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430FG4270IRGZT 功能描述:16位微控制器 - MCU 16-Bit 32kB Flash 256K RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430FG437IPN 功能描述:16位微控制器 - MCU 32KB Flash 1KB RAM 12ADC/2DAC 128sLCD RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430FG437IPNR 功能描述:16位微控制器 - MCU 32KB Flash 1KB RAM 12ADC/2DAC 128sLCD RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
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