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参数资料
| 型号： | MSU2031C25 |
| 厂商： | Mosel Vitelic, Corp. |
| 英文描述： | low working voltage 16 MHz ROM less MCU |
| 中文描述： | 低工作电压低于16兆赫ROM的单片机 |
| 文件页数： | 9/21页 |
| 文件大小： | 119K |
| 代理商： | MSU2031C25 |
17
Rev. 1.0 February 1998
MOSEL VITELIC
MSU2051/U2031
Symbol
A
A1
A2
b
c
D
D1
D2
E
E1
E2
e
L
L1
R1
R2
S
Dimension in Inch
minimal/maximal
- / 0.063
0.002 / 0.006
0.053 / 0.057
0.012 / 0.018
0.004 / 0.008
0.472 BSC
0.393 BSC
0.315
0.472 BSC
0.393 BSC
0.315
0.031 BSC
0.018 / 0.030
0.039 REF
0.003 / -
0.003 / 0.008
Dimension in mm
minimal/maximal
- / 1.60
0.05 / 0.15
1.35 / 1.45
0.30 / 0.45
0.09 / 0.20
12.00 BSC
10.00 BSC
8.00
12.00 BSC
10.00 BSC
8.00
0.80 BSC
0.45 / 0.75
1.00 REF
0.08 / -
0.08 / 0.20
0.20 / -
as left
θ
C
θ
1
2
3
0
° / 7°
0
° / -
11
°
Note:
Dimension D1 and E1 do not include mold
protrustion. Allowance protrusion is 0.25mm per side.
D1 and E1 are maximal plastic body size dimensions
including mold mismatch.
Dimension b does not include dambar protrusion.
Allowance dambar protrusion shall not cause the
lead width to exceed the maximal b dimension by
more than 0.08 mm.
Dambar can not be located on the lower radius or the
foot. Minimal space between protrusion and an
adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm
pitch packages.
44L Low profile Quad Flat Package
1.
2.
3.
/13
°
11
°/13°
0.004
0.10
E2
E1
E
D2 D1 D
θ
seating plane
C
A2
A1
A
C
L
L1
S
e
b
R2
R1
θ3
θ2
01
Gage Plane
0.25 mm
0.008 / -
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MSU2031C40 | 制造商:MOSEL 制造商全称:MOSEL 功能描述:low working voltage 16 MHz ROM less MCU |
| MSU2031L16 | 制造商:MOSEL 制造商全称:MOSEL 功能描述:low working voltage 16 MHz ROM less MCU |
| MSU2031S16 | 制造商:MOSEL 制造商全称:MOSEL 功能描述:low working voltage 16 MHz ROM less MCU |
| MSU2032C16 | 制造商:MOSEL 制造商全称:MOSEL 功能描述:low working voltage 16 MHz ROM less MCU |
| MSU2032C25 | 制造商:MOSEL 制造商全称:MOSEL 功能描述:low working voltage 16 MHz ROM less MCU |
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