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| 型号： | MTB23P06V |
| 厂商： | MOTOROLA INC |
| 元件分类： | JFETs |
| 英文描述： | IC REG LDO 750MA ADJ TO263-5 |
| 中文描述： | 23 A, 60 V, 0.12 ohm, P-CHANNEL, Si, POWER, MOSFET |
| 文件页数： | 7/10页 |
| 文件大小： | 280K |
| 代理商： | MTB23P06V |
7
Motorola TMOS Power MOSFET Transistor Device Data
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
mm
inches
0.33
8.38
0.08
2.032
0.04
1.016
0.63
17.02
0.42
10.66
0.12
3.05
0.24
6.096
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
The power dissipation for a surface mount device is a
function of the drain pad size. These can vary from the
minimum pad size for soldering to a pad size given for
maximum power dissipation. Power dissipation for a surface
mount device is determined by TJ(max), the maximum rated
junction temperature of the die, R
θ
JA, the thermal resistance
from the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data sheet,
PD can be calculated as follows:
PD =
TJ(max) – TA
R
θ
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25
°
C, one can
calculate the power dissipation of the device. For a D2PAK
device, PD is calculated as follows.
PD =
150
°
C – 25
°
C
50
°
C/W
= 2.5 Watts
The 50
°
C/W for the D2PAK package assumes the use of the
recommended footprint on a glass epoxy printed circuit board
to achieve a power dissipation of 2.5 Watts. There are other
alternatives to achieving higher power dissipation from the
surface mount packages. One is to increase the area of the
drain pad. By increasing the area of the drain pad, the power
dissipation can be increased. Although one can almost double
the power dissipation with this method, one will be giving up
area on the printed circuit board which can defeat the purpose
of using surface mount technology. For example, a graph of
R
θ
JA versus drain pad area is shown in Figure 16.
T
°
R
θ
A, Area (square inches)
TA = 25
°
C
60
70
50
40
30
20
16
14
12
10
8
6
4
2
0
2.5 Watts
3.5 Watts
5 Watts
Board Material = 0.0625
″
G–10/FR–4, 2 oz Copper
Figure 16. Thermal Resistance versus Drain
Pad Area for the D2PAK Package (Typical)
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad
. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
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| MTD1P50E | TMOS POWER FET 1.0 AMPERES 500 VOLTS 15 OHM |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MTB23P06VT4 | 功能描述:MOSFET P-CH 60V 23A D2PAK RoHS:否 类别:分离式半导体产品 >> FET - 单 系列:- 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件 |
| MTB2-3PH001 | 制造商:ITT Interconnect Solutions 功能描述:MTB2-3PH001 - Bulk |
| MTB2-3PH016 | 制造商:ITT Interconnect Solutions 功能描述:Cable Assembly Pre-Wired Pigtail 0.152m 26AWG 3 POS Micro Strip PIN Crimp |
| MTB2-3PS | 制造商:ITT Interconnect Solutions 功能描述:Conn Unshrouded Header PIN 3 POS 2.54mm Solder Cup ST Cable Mount |
| MTB2-3SAL1 | 制造商:ITT Interconnect Solutions 功能描述:Conn Socket Strip SKT 3 POS 2.54mm Solder RA Thru-Hole |
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