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参数资料
| 型号： | MTB23P06V |
| 厂商： | MOTOROLA INC |
| 元件分类： | JFETs |
| 英文描述： | IC REG LDO 750MA ADJ TO263-5 |
| 中文描述： | 23 A, 60 V, 0.12 ohm, P-CHANNEL, Si, POWER, MOSFET |
| 文件页数： | 9/10页 |
| 文件大小： | 280K |
| 代理商： | MTB23P06V |
9
Motorola TMOS Power MOSFET Transistor Device Data
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a figure
for belt speed. Taken together, these control settings make up
a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remembers
these profiles from one operating session to the next. Figure
18 shows a typical heating profile for use when soldering a
surface mount device to a printed circuit board. This profile will
vary among soldering systems but it is a good starting point.
Factors that can affect the profile include the type of soldering
system in use, density and types of components on the board,
type of solder used, and the type of board or substrate material
being used. This profile shows temperature versus time. The
line on the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/in-
frared reflow soldering system was used to generate this
profile. The type of solder used was 62/36/2 Tin Lead Silver
with a melting point between 177–189
°
C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
170
°
C
STEP 6
VENT
STEP 7
COOLING
200
°
C
150
°
C
100
°
C
50
°
C
TIME (3 TO 7 MINUTES TOTAL)
Figure 18. Typical Solder Heating Profile
TMAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
°
TO 219
°
C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
100
°
C
150
°
C
160
°
C
140
°
C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
相关PDF资料 |
PDF描述 |
|---|---|
| MTB50P03HDL | TMOS POWER FET LOGIC LEVEL 50 AMPERES 30 VOLTS |
| MTB75N03HDL | TMOS POWER FET LOGIC LEVEL 75 AMPERES 25 VOLTS |
| MTB8N50E | TMOS POWER FET 8.0 AMPERES 500 VOLTS |
| MTD1P50E | TMOS POWER FET 1.0 AMPERES 500 VOLTS 15 OHM |
| MTD2N40E | TMOS POWER FET 2.0 AMPERES 400 VOLTS RDS(on) = 3.5 OHM |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MTB23P06VT4 | 功能描述:MOSFET P-CH 60V 23A D2PAK RoHS:否 类别:分离式半导体产品 >> FET - 单 系列:- 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件 |
| MTB2-3PH001 | 制造商:ITT Interconnect Solutions 功能描述:MTB2-3PH001 - Bulk |
| MTB2-3PH016 | 制造商:ITT Interconnect Solutions 功能描述:Cable Assembly Pre-Wired Pigtail 0.152m 26AWG 3 POS Micro Strip PIN Crimp |
| MTB2-3PS | 制造商:ITT Interconnect Solutions 功能描述:Conn Unshrouded Header PIN 3 POS 2.54mm Solder Cup ST Cable Mount |
| MTB2-3SAL1 | 制造商:ITT Interconnect Solutions 功能描述:Conn Socket Strip SKT 3 POS 2.54mm Solder RA Thru-Hole |
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