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参数资料
| 型号： | MTB75N03HDLT4 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | JFETs |
| 英文描述： | 75 A, 25 V, 0.009 ohm, N-CHANNEL, Si, POWER, MOSFET |
| 封装： | D2PAK-3 |
| 文件页数： | 11/12页 |
| 文件大小： | 256K |
| 代理商： | MTB75N03HDLT4 |
MTB75N03HDL
http://onsemi.com
8
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to ensure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
mm
inches
0.33
8.38
0.08
2.032
0.04
1.016
0.63
17.02
0.42
10.66
0.12
3.05
0.24
6.096
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
The power dissipation for a surface mount device is a
function of the drain pad size. These can vary from the
minimum pad size for soldering to a pad size given for
maximum power dissipation. Power dissipation for a
surface mount device is determined by TJ(max), the
maximum rated junction temperature of the die, RθJA, the
thermal resistance from the device junction to ambient, and
the operating temperature, TA. Using the values provided
on the data sheet, PD can be calculated as follows:
PD =
TJ(max) TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device. For a
D2PAK device, PD is calculated as follows.
PD =
150
°C 25°C
50
°C/W
= 2.5 Watts
The 50
°C/W for the D2PAK package assumes the use of
the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 2.5 Watts. There are
other alternatives to achieving higher power dissipation
from the surface mount packages. One is to increase the
area of the drain pad. By increasing the area of the drain
pad, the power dissipation can be increased. Although one
can almost double the power dissipation with this method,
one will be giving up area on the printed circuit board
which can defeat the purpose of using surface mount
technology. For example, a graph of RθJA versus drain pad
area is shown in Figure 17.
Figure 16. Thermal Resistance versus Drain Pad
Area for the D2PAK Package (Typical)
A, AREA (SQUARE INCHES)
60
70
50
40
30
20
16
14
12
10
8
6
4
2
0
TO
AMBIENT
(
C/W)°
R
JA
,THERMAL
RESIST
ANCE,
JUNCTION
θ
5 Watts
3.5 Watts
2.5 Watts
Board Material = 0.0625″
G10/FR4, 2 oz Copper
TA = 25°C
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MTB75N05HD | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:TMOS POWER FET 75 AMPERES 50 VOLTS |
| MTB75N05HDT4 | 功能描述:MOSFET N-CH 50V 75A D2PAK-3 RoHS:否 类别:分离式半导体产品 >> FET - 单 系列:- 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件 |
| MTB75N06 | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:TMOS POWER FET 75 AMPERES 60 VOLTS |
| MTB75N06HD | 制造商:ON Semiconductor 功能描述:Trans MOSFET N-CH 60V 75A 3-Pin(2+Tab) D2PAK Rail |
| MTB7671 | 制造商:Megger 功能描述:METER TEST BOX |
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