- 您现在的位置：买卖IC网 > PDF目录98048 > MUN2134T3 (ON SEMICONDUCTOR) 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR PDF资料下载
参数资料
| 型号： | MUN2134T3 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 小信号晶体管 |
| 英文描述： | 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR |
| 封装： | SC-59, 3 PIN |
| 文件页数： | 26/38页 |
| 文件大小： | 385K |
| 代理商： | MUN2134T3 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页当前第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页
Reliability and Quality Assurance
9–16
Motorola Small–Signal Transistors, FETs and Diodes Device Data
MECHANICAL SHOCK
This test is used to determine the ability of the device to
withstand a sudden change in mechanical stress due to abrupt
changes in motion as seen in handling, transportation, or
actual use.
Typical Test Conditions: Acceleration = 1500 g’s, Orienta-
tion = X1, Y1, Y2 plane, t = 0.5 msec, Blows = 5
Common Failure Modes: Open, short, excessive leak-
age, mechanical failure
Common Failure Mechanisms: Die and wire bonds,
cracked die, package defects
Military Reference: MIL–STD–750, Method 2015
MOISTURE RESISTANCE
The purpose of this test is to evaluate the moisture resistance
of components under temperature/humidity conditions typical
of tropical environments.
Typical Test Conditions: TA = –10°C to 65°C, rh = 80%
to 98%, t = 24 hours/cycles, cycle = 10
Common Failure Modes: Parametric shifts in leakage
and mechanical failure
Common Failure Mechanisms: Corrosion or contami-
nants on or within the package materials. Poor package
sealing
Military Reference: MIL–STD–750, Method 1021
SOLDERABILITY
The purpose of this test is to measure the ability of the device
leads/terminals to be soldered after an extended period of
storage (shelf life).
Typical Test Conditions: Steam aging = 8 hours, Flux =
R, Solder = Sn60, Sn63
Common Failure Modes: Pin holes, dewetting, nonwet-
ting
Common Failure Mechanisms: Poor plating, contami-
nated leads
Military Reference: MIL–STD–750, Method 2026
SOLDER HEAT
This test is used to measure the ability of a device to withstand
the temperatures as may be seen in wave soldering
operations. Electrical testing is the endpoint critierion for this
stress.
Typical Test Conditions: Solder Temperature = 260
°C, t
= 10 seconds
Common Failure Modes: Parameter shifts, mechanical
failure
Common Failure Mechanisms: Poor package design
Military Reference: MIL–STD–750, Method 2031
STEADY STATE OPERATING LIFE (SSOL)
The purpose of this test is to evaluate the bulk stability of the
die and to generate defects resulting from manufacturing
aberrations
that
are
manifested
as
time
and
stress–dependent failures.
Typical Test Conditions: TA = 25°C, PD = Data Book
maximum rating, t = 16 to 1000 hours
Common Failure Modes: Parametric shifts and cata-
strophic
Common Failure Mechanisms: Foreign material, crack
die, bulk die, metallization, wire and die bond defects
Military Reference: MIL–STD–750, Method 1026
TEMPERATURE CYCLING (AIR TO AIR)
The purpose of this test is to evaluate the ability of the device
to withstand both exposure to extreme temperatures and
transitions between temperature extremes. This testing will
also expose excessive thermal mismatch between materials.
Typical Test Conditions: TA = –65°C to 200°C, cycle =
10 to 4000
Common Failure Modes: Parametric shifts and cata-
strophic
Common Failure Mechanisms: Wire bond, cracked or
lifted die and package failure
Military Reference: MIL–STD–750, Method 1051
THERMAL SHOCK (LIQUID TO LIQUID)
The purpose of this test is to evaluate the ability of the device
to withstand both exposure to extreme temperatures and
sudden transitions between temperature extremes. This
testing will also expose excessive thermal mismatch between
materials.
Typical Test Conditions: TA = 0°C to 100°C, cycle = 20
to 300
Common Failure Modes: Parametric shifts and cata-
strophic
Common Failure Mechanisms: Wire bond, cracked or
lifted die and package failure
Military Reference: MIL–STD–750, Method 1056
VARIABLE FREQUENCY VIBRATION
This test is used to examine the ability of the device to
withstand deterioration due to mechanical resonance.
Typical Test Conditions: Peak acceleration = 20 g’s,
Frequency range = 20 Hz to KHz, t = 48 minutes
Common Failure Modes: Open, short, excessive leak-
age, mechanical failure
Common Failure Mechanisms: Die and wire bonds,
cracked die, package defects
Military Reference: MIL–STD–750, Method 2056
相关PDF资料 |
PDF描述 |
|---|---|
| MUN2131T3 | 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR |
| MUN2116T3 | 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR |
| MUN2114T3 | 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR |
| MUN2111T3 | 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR |
| MUN2132T3G | 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MUN2135T1G | 制造商:ON Semiconductor 功能描述:PNP DIGITAL TRANSISTOR (B - Tape and Reel 制造商:ON Semiconductor 功能描述:PNP DIGITAL TRANSISTOR (B - Cut TR (SOS) 制造商:ON Semiconductor 功能描述:REEL / PNP DIGITAL TRANSISTOR (B |
| MUN2136 | 制造商:WEITRON 制造商全称:Weitron Technology 功能描述:Bias Resistor Transistor PNP Silicon |
| MUN2136T1 | 功能描述:TRANS BRT PNP 100MA 50V SC59 RoHS:否 类别:分离式半导体产品 >> 晶体管(BJT) - 单路﹐预偏压式 系列:- 标准包装:10,000 系列:- 晶体管类型:NPN - 预偏压 电流 - 集电极 (Ic)（最大）:100mA 电压 - 集电极发射极击穿（最大）:50V 电阻器 - 基极 (R1)（欧）:47k 电阻器 - 发射极 (R2)（欧）:47k 在某 Ic、Vce 时的最小直流电流增益 (hFE):70 @ 5mA，5V Ib、Ic条件下的Vce饱和度（最大）:300mV @ 500µA，10mA 电流 - 集电极截止（最大）:- 频率 - 转换:100MHz 功率 - 最大:250mW 安装类型:表面贴装 封装/外壳:SC-70，SOT-323 供应商设备封装:PG-SOT323-3 包装:带卷 (TR) 其它名称:SP000756242 |
| MUN2136T1G | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Bias Resistor Transistors |
| MUN2137 | 制造商:WEITRON 制造商全称:Weitron Technology 功能描述:Bias Resistor Transistor PNP Silicon |
发布紧急采购，3分钟左右您将得到回复。