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| 型号： | MX857BTR |
| 厂商： | IXYS Integrated Circuits Division |
| 文件页数： | 7/7页 |
| 文件大小： | 0K |
| 描述： | IC LEVEL SHIFTER 1CH HS 8-SOIC |
| 标准包装： | 1,000 |
| 逻辑功能： | 电平移位器 |
| 位数： | 1 |
| 输入类型： | CMOS/TTL |
| 输出类型： | 电压 |
| 通道数： | 1 |
| 输出/通道数目： | 2 |
| 差分 - 输入:输出： | 无/是 |
| 传输延迟（最大）： | 20ns |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
INTEGRATED CIRCUITS DIVISION
MX856/MX857
R01
www.ixysic.com
7
2.4 Mechanical Dimensions
2.4.1 MX856B/MX857B 8-Lead SOIC Package
2.4.2 MX856BTR/MX857BTR Tape & Reel Dimensions
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
Recommended PCB Land Pattern
NOTES: (Unless otherwise specified)
1. Controlling dimensions: millimeters.
2. Dimensions (*) do not include mold protrusions.
3. Molded package shall conform to JEDEC standard configuration MS-012 variation AA.
1.35 / 1.75
(0.053 / 0.069)
0.53 REF
(0.021 REF)
0.10 / 0.25
(0.004 / 0.010)
4.80 / 5.00
*
(0.189 / 0.197)
PIN 1
0.33 / 0.51
(0.013 / 0.020)
5.80 / 6.20
(0.228 / 0.244)
3.80 / 4.00
*
(0.150 / 0.157)
1.27 BSC
(0.05 BSC)
0.40 / 1.27
(0.016 / 0.050)
0.19 / 0.25
(0.008 / 0.010)
0.25 / 0.50 @45
(0.010 / 0.020 @45)
0 / 8
1.27
(0.050)
5.40
(0.213)
1.55
(0.061)
0.60
(0.024)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.066 MAX.
(0.0026 MAX.)
330.2 DIA.
(13.00 DIA.)
3.40 REF
(0.134 REF)
B
0=5.20 ± 0.10
(B
0=0.205 ± 0.004)
0.30 ± 0.05
(0.012 ± 0.002)
5.50 ± 0.10
(0.217 ± 0.004)
12.00 ± 0.30
(0.472 ± 0.012)
1.75 ± 0.10
(0.205 ± 0.069)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.10
(0.079 ± 0.004)
1.55 ± 0.05
(0.061 ± 0.002)
1.50 MIN
(0.059 MIN)
8.00 ± 0.10
(0.315 ± 0.004)
A
B
R0.5 TYP
(R0.02 TYP)
A
0=6.40 ± 0.10
(A
0=0.252 ± 0.004)
4.70 REF
(0.185 REF)
1.20 REF
(0.047 REF)
70
K
0=2.30 ± 0.10
(K
0=0.091 ± 0.004)
1.80 ± 0.10
(0.071 ± 0.004)
NOTES:
1. A0 and B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. ±0.2mm.
DIMENSIONS
mm
(inches)
Section B-B
Section A-A
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-MX856/MX857-20110729
Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
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