参数资料
型号: NB100EP223FA
厂商: ON Semiconductor
文件页数: 10/10页
文件大小: 0K
描述: IC CLOCK BUFFER MUX 2:22 64-LQFP
产品变化通告: Product Obsolescence 01/Jul/2005
标准包装: 160
系列: 100EP
类型: 扇出缓冲器(分配),多路复用器
电路数: 1
比率 - 输入:输出: 2:22
差分 - 输入:输出: 是/是
输入: HSTL,LVDS,LVPECL
输出: HSTL
频率 - 最大: 500MHz
电源电压: 3 V ~ 3.6 V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-LQFP 裸露焊盘
供应商设备封装: 64-LQFP(10x10)
包装: 托盘
其它名称: NB100EP223FAOS
NB100EP223
http://onsemi.com
9
PACKAGE DIMENSIONS
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MM.
3. DATUM PLANE E" IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING PLANE.
4. DATUM X", Y" AND Z" TO BE DETERMINED AT
DATUM PLANE DATUM E".
5. DIMENSIONS M AND L TO BE DETERMINED AT
SEATING PLANE DATUM T".
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLAND E".
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED THE MAXIMUM D DIMENSION
BY MORE THAN 0.08 (0.003). DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD OR PROTRUSION 0.07
(0.003).
8. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
DIM
A
MIN
MAX
MIN
MAX
INCHES
10.00 BSC
0.394 BSC
MILLIMETERS
B
10.00 BSC
0.394 BSC
C
1.35
1.45
0.053
0.057
D
0.17
0.27
0.007
0.011
F
0.45
0.75
0.018
0.030
G
0.50 BSC
0.020 BSC
H
1.00 REF
0.039 BSC
J
0.09
0.20
0.004
0.008
K
0.05
0.15
0.002
0.006
L
12.00 BSC
0.472 BSC
M
12.00 BSC
0.472 BSC
N
0.20
0.008
P
0
7
0
7
R
0
0
S
1.60
0.063
V
W
AA
0.17
0.23
0.007
0.009
AB
0.09
0.16
0.004
0.006
AC
0.08
0.003
AD
0.08
0.003
AE
4.50
4.78
0.180
0.188
0.05 (0.002) S
1
B
B/2
16
17
32
33
48
49
64
X
L
L/2
Z
M
M/2
A
A/2
AJ
Z
0.20 (0.008) T XY
4 PL
Z
0.20 (0.008) E XY
T
SEATING
PLANE
G/2
G
4 PL
AG
D 64 PL
Z
0.08 (0.003) M T XY
E
0.08 (0.003) T
EXPOSED PAD
VIEW AGAG
DETAIL AH
___
_
__
AA
D
AB
J
DETAIL AJAJ
REF
BASE
METAL
PLATING
Z
0.08 (0.003) M Y TU
S C
K
V
R
W
N
F
H
P
AC
0.25
GAGE
PLANE
60 PL
1
16
17
32
33
48
49
64
AD
11
13
11
13
___
_
11
13
11
13
___
_
AF
4.50
4.78
0.180
0.188
AE
AF
LQFP 64 LEAD EXPOSED PAD
848G02
ISSUE A
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