参数资料
型号: NB3L553DG
厂商: ON Semiconductor
文件页数: 8/8页
文件大小: 0K
描述: IC CLK BUFFER 1:4 200MHZ 8-SOIC
标准包装: 98
类型: 扇出缓冲器(分配)
电路数: 1
比率 - 输入:输出: 1:4
差分 - 输入:输出: 无/无
输入: LVCMOS,LVTTL
输出: LVCMOS,LVTTL
频率 - 最大: 200MHz
电源电压: 2.375 V ~ 5.25 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 管件
产品目录页面: 1115 (CN2011-ZH PDF)
其它名称: NB3L553DG-ND
NB3L553DGOS
NB3L553
http://onsemi.com
8
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AA01
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C
0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C
0.10
C
0.10
C
0.08
NOTE 4
A1
SEATING
PLANE
e/2
e
8X
K
NOTE 3
b
8X
0.10
C
0.05
C
A B
B
DIM
MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.20
0.30
D
2.00 BSC
D2
1.10
1.30
E
2.00 BSC
E2
0.70
0.90
e
0.50 BSC
K
L
0.25
0.35
1
4
8
5
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.30
0.50
8X
DIMENSIONS: MILLIMETERS
0.30
PITCH
8X
1
PACKAGE
OUTLINE
RECOMMENDED
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
L1
0.10
0.30 REF
0.90
1.30
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particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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