参数资料
| 型号： | NB3N106KMNR2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 1/10页 |
| 文件大小： | 0K |
| 描述： | IC FANOUT BUFFER 1:6 HCSL 24QFN |
| 标准包装： | 3,000 |
| 类型： | 扇出缓冲器（分配） |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:6 |
| 差分 - 输入:输出： | 是/是 |
| 输入： | HCSL, LVCMOS, LVDS, LVPECL, LVTTL |
| 输出： | HCSL，LVDS |
| 频率 - 最大： | 400MHz |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘 |
| 供应商设备封装： | 24-QFN（4x4） |
| 包装： | 带卷 (TR) |
Semiconductor Components Industries, LLC, 2012
April, 2012 Rev. 5
1
Publication Order Number:
NB3N106K/D
NB3N106K
3.3V Differential 1:6 Fanout
Clock Driver with HCSL
Outputs
Description
The NB3N106K is a differential 1:6 Clock fanout buffer with
Highspeed Current Steering Logic (HCSL) outputs optimized for
ultra low propagation delay variation. The NB3N106K is designed
with HCSL PCI Express clock distribution and FBDIMM
applications in mind.
Inputs can directly accept differential LVPECL, LVDS, and HCSL
LVCMOS, or LVTTL levels are accepted with a proper external Vth
internal 50
W termination resistors allowing additional single ended
system interconnect flexibility.
Output drive current is set by connecting a 475
W resistor from
IREF (Pin 1) to GND per Figure 6. Outputs can also interface to
LVDS receivers when terminated per Figure 11.
The NB3N106K specifically guarantees low output–to–output
skew. Optimal design, layout, and processing minimize skew within a
device and from device to device. System designers can take
advantage of the NB3N106K’s performance to distribute low skew
clocks across the backplane or the motherboard.
Features
Typical Input Clock Frequency 100, 133, 166, 200, 266, 333, and
400 MHz
220 ps Typical Rise and Fall Times
800 ps Typical Propagation Delay
Dtpd 100 ps Maximum Propagation Delay Variation per Diff Pair
0.1 ps Typical Integrated Phase Jitter RMS
Operating Range: VCC = 3.0 V to 3.6 V with VEE = 0 V
Typical HCSL Output Levels (700 mV PeaktoPeak)
LVDS Output Levels with Interface Termination
These are PbFree Devices*
Applications
Clock Distribution
PCIe, II, III
Networking and Communications
High End Computing
End Products
Servers
FBDIMM Memory Cards
Ethernet Switch/Routers
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*For additional marking information, refer to
Application Note AND8002/D.
QFN24
MN SUFFIX
CASE 485L
MARKING DIAGRAM*
http://onsemi.com
Figure 1. Simplified Logic Diagram
Q0
Q1
Q4
Q5
CLK
VCC
GND
RREF
IREF
See detailed ordering and shipping information in the
package dimensions section on page 9 of this data sheet.
ORDERING INFORMATION
VTCLK
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= PbFree Package
NB3N
106K
ALYWG
G
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NB3N108KMNG | 功能描述:时钟缓冲器 1:8 HCSL FAN-OUT BUFFER RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| NB3N108KMNR4G | 功能描述:时钟缓冲器 1:8 HCSL FAN-OUT BUFFER RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| NB3N111KMNG | 功能描述:时钟缓冲器 1:10 HCSL FAN-OUT BUFFER RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| NB3N111KMNR4G | 功能描述:时钟缓冲器 1:10 HCSL FAN-OUT BUFFER RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| NB3N1200K | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Differential 1:12 HCSL or Push-Pull Clock ZDB/Fanout Buffer for PCle |
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