参数资料
| 型号： | NBSG14BAHTBG |
| 厂商： | ON Semiconductor |
| 文件页数： | 5/13页 |
| 文件大小： | 0K |
| 描述： | IC CLOCK/DATA BUFFER 1:4 16FCBGA |
| 产品变化通告： | Product Obsolescence 05/Oct/2010 |
| 标准包装： | 100 |
| 类型： | 扇出缓冲器（分配），数据 |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:4 |
| 差分 - 输入:输出： | 是/是 |
| 输入： | CML，LVCMOS，LVDS，LVTTL，NECL，PECL，RSECL |
| 输出： | RSECL，RSNECL，RSPECL |
| 频率 - 最大： | 12GHz |
| 电源电压： | 2.375 V ~ 3.465 V |
| 工作温度： | -40°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-LBGA，FCBGA |
| 供应商设备封装： | 16-FCBGA（4x4） |
| 包装： | 带卷 (TR) |
NBSG14
http://onsemi.com
13
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G01
ISSUE E
16X
SEATING
PLANE
L
D
E
0.10 C
A
A1
e
D2
E2
b
1
4
8
9
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
B
A
0.10 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.05 C
(A3)
C
NOTE 4
16X
0.10 C
0.05 C
A B
NOTE 3
K
16X
DIM MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.18
0.30
D
3.00 BSC
D2
1.65
1.85
E
3.00 BSC
E2
1.65
1.85
e
0.50 BSC
K
L
0.30
0.50
0.18 TYP
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL A
DETAIL B
L1
0.00
0.15
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
2X
0.50
PITCH
1.84 3.30
1
DIMENSIONS: MILLIMETERS
0.58
16X
2X
0.30
16X
OUTLINE
PACKAGE
2X
0.10 C A B
e/2
SOLDERING FOOTPRINT*
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81357733850
NBSG14/D
LITERATURE FULFILLMENT:
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P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
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