参数资料
型号: NBSG16BAEVB
厂商: ON Semiconductor
文件页数: 3/12页
文件大小: 0K
描述: BOARD EVALUATION BBG NBSG16BA
产品变化通告: Product Discontinuation 21/Jun/2007
标准包装: 1
NBSG16
http://onsemi.com
11
PACKAGE DIMENSIONS
FCBGA16
BA SUFFIX
PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE
CASE 48901
ISSUE O
0.20
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
D
E
M
A1
A2
A
0.10 Z
0.15 Z
ROTATED 90 CLOCKWISE
DETAIL K
_
5
VIEW MM
e
3 X
S
M
X
0.15
Y
Z
0.08
Z
3
b
16 X
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
43
21
A
B
C
D
4
16 X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
MIN
MAX
MILLIMETERS
A
1.40 MAX
A1
0.25
0.35
A2
1.20 REF
b
0.30
0.50
D
4.00 BSC
E
4.00 BSC
e
1.00 BSC
S
0.50 BSC
K
X
Y
M
Z
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