参数资料
型号: NBSG16BAEVB
厂商: ON Semiconductor
文件页数: 7/12页
文件大小: 0K
描述: BOARD EVALUATION BBG NBSG16BA
产品变化通告: Product Discontinuation 21/Jun/2007
标准包装: 1
NBSG16
http://onsemi.com
4
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
VEE = 0 V
3.6
V
VEE
Negative Power Supply
VCC = 0 V
3.6
V
VI
Positive Input
Negative Input
VEE = 0 V
VCC = 0 V
VI VCC
VI VEE
3.6
V
VINPP
Differential Input Voltage
|D D| VCC VEE w 2.8 V
VCC VEE <
2.8 V
2.8
|VCC VEE|
V
Iout
Output Current
Continuous
Surge
25
50
mA
IBB
VBB Sink/Source
1
mA
IMM
VMM Sink/Source
1
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
(Note 2)
0 lfpm
500 lfpm
0 lfpm
500 lfpm
FCBGA16
QFN16
108
86
41.6
35.2
°C/W
qJC
Thermal Resistance (JunctiontoCase)
1S2P (Note 2)
2S2P (Note 3)
FCBGA16
QFN16
5
4.0
°C/W
Tsol
Wave Solder
Pb
PbFree
225
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board 1S2P (1 signal, 2 power)
3. JEDEC standard multilayer board 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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