参数资料
型号: NBSG16BAR2
厂商: ON Semiconductor
文件页数: 5/12页
文件大小: 0K
描述: IC RCVR/DRVR RSECL SIGE 16FCBGA
产品变化通告: Product Discontinuation 20/Aug/2008
标准包装: 1
类型: 收发器
应用: 仪表
安装类型: 表面贴装
封装/外壳: 16-LBGA,FCBGA
供应商设备封装: 16-FCBGA(4x4)
包装: 标准包装
其它名称: NBSG16BAR2OSDKR
NBSG16
http://onsemi.com
2
Figure 1. BGA16 Pinout (Top View)
VEE
D
VTD
VEE
VBB
VTD
NC
VEE
VCC
VMM
VEE
Q
A
B
C
D
12
3
4
VEE NC
NC VEE
VEE VBB VMM VEE
VCC
Q
VCC
VTD
D
VTD
56
7
8
16
15
14
13
12
11
10
9
1
2
3
4
NBSG16
Exposed Pad (EP)
Figure 2. QFN16 Pinout (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Description
BGA
QFN
C2
1
VTD
Internal 50 W Termination Pin. See Table 2.
C1
2
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Inverted Differential Input. Internal 75 kW to VEE and 36.5 kW to VCC.
B1
3
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Noninverted differential input. Internal 75 kW to VEE
B2
4
VTD
Internal 50 W Termination Pin. See Table 2.
A1,D1,A4,
D4
5,8,13,16
VEE
Negative Supply Voltage
A2,A3
6,7
NC
No Connect
B3,C3
9,12
VCC
Positive Supply Voltage
B4
10
Q
RSECL Output
Noninverted Differential Output. Typically Terminated with 50 W to
VTT = VCC 2 V
C4
11
Q
RSECL Output
Inverted Differential Output. Typically Terminated with 50 W to VTT = VCC 2 V
D3
14
VMM
LVCMOS Reference Voltage Output. (VCC VEE)/2
D2
15
VBB
ECL Reference Voltage Output
N/A
EP
The Exposed Pad (EP) and the QFN16 package bottom is thermally connected
to the die for improved heat transfer out of package. The exposed pad must be
attached to a heatsinking conduit. The pad is not electrically connected to the
die but may be electrically and thermally connected to VEE on the PC board.
1. The NC pins are electrically connected to the die and MUST be left open.
2. All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
bottom (see case drawing) must be attached to a heatsinking conduit.
3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal
is applied then the device will be susceptible to selfoscillation.
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